Electromagnetic Compatibility (Emc) Design and Test Case Analysis (Hardcover)

Preface

Exordium

Introduction

Chapter 1 The EMC Basic Knowledge and the Essence of EMC Test

What is EMC?

1.1 Conduction, Radiation and Transient

1.2 Theoretical Basis

1.3.1 Time-Domain and Frequency-Domain

1.3.2 The Concept of the unit for electromagnetic disturbance, dB

1.3.3 To Correctly Understand the True Meaning of Decibel

1.3.4 Electric Field, Magnetic Field and Antenna

1.3.5 Resonant of RLC Circuit

1.4 Common-Mode and Differential-Mode in the Sense of EMC

1.5 EMC test substance

1.5.1 Substance of radiation emission test

1.5.2 Substance of conduction disturbance test

1.5.3 Substance of ESD immunity test

1.5.4 Substance of radiation immunity test

1.5.5 The essence of common mode conductivity immunity test

1.5.6 The essence of the test of the differential mode conductivity anti-interference.

1.5.7conductivity immunity test for differential and common mode

Chapter 2 Architecture, Shielding, Grounding versus EMC of the Product

2.1 Introduction

2.1.1 Architecture and EMC of the Product

2.1.2 Shielding and EMC of the Product

2.1.3 Grounding and EMC of the Product

2.2 Analyses of related cases

2.2.1 Case 1: Conduction Interference and Grounding

2.2.2 Case 2: The ground loop which must be taken care of during the conduction interference test

2.2.3 Case 3: Where the Radiation outside the shielding comes from

2.2.4 Case 4: "Vacant" Metal and Radiation

2.2.5 Case 5: The Radiation Caused By the Stud Which Reaches Out Of the Shielding Body

2.2.6 Case 6: The amount of compression and the shielding performance of shielding material

2.2.7 Case 7: The effect on EMI from the shielding layer between primary and secondary coil of the transformer in switching power

2.2.8 Case 8: Bad contact for metal shell and system reset

2.2.9 Case 9: Electrostatic discharge and screw

2.2.10 Case 10: Heat Radiator Also Affects ESD

2.2.11 Case 11: How Can Grounding Benefit EMC?

2.2.12 Case 12: Radiator form affects the conducted emission of power port

2.2.13 Case 13: Metal shielding shell can lead to EMI test failure

2.2.14 Case 14: PCB ground attached directly to the metal case will lead to the ESD interference.

2.2.15 Case 15: How to access the digital ground to analog ground in mixed digital and analog devices

Chapter 3 The Cables, Connectors, Interface Circuit in Products versus EMC

3.1 Introduction

3.1.1 Cable is the weakest link in the system

3.1.2 The interface circuit is an important means to solve the problem of cable radiation

3.1.3 Connectors are the channel between interface circuit and cable

3.1.4 Interconnection between the PCB is the weakest link of the product EMC

3.2 Analyses of related cases

3.2.1 Case 16: Excessive Radiation Caused by Cable Wiring

3.2.2 Case 17: How much is the influence of Pigtail in shielded cables

3.2.3 Case 18: The Radiation out of Grounding Wire

3.2.4 Case 19: Is the Shielded Wire Better than the Ordinary Line?

3.2.5 Case 20: The Effect of Plastic Shell Connectors and Metal Shell Connector on ESD

3.2.6 Case 21: The Selection of Plastic Shell Connector and ESD

3.2.7 Case 22: The Shielding Layer of the Shielded Cable Cannot Ground

3.2.8 Case 23: Two EMC Design Problems Triggered by Digital Camera Radiation Disturbance

3.2.9 Case 24: Why PCB Interconnect Ribbon Cable is So Important for EMC

3.2.10 Case 25: Excessive Radiation Emission Caused by the Loop

3.2.11 Case 26: Pay Attention to Interconnection and Wiring in Product Internal

3.2.12 Case 27: The result of mixed wiring for signal line and power line

3.2.13 Case 28: What should be noticed when installing power filters

Chapter 4 Filtering and Suppression for EMC Performance Improvement

4.1 Introduction

4.1.1 Filter and filter device

4.1.2 Anti surge circuit components

4.2 Analyses of related cases

4.2.1 Case 29: The Emission Caused by Hub Exceeds the Standard

4.2.2 Case 30: The Installation of Power Filter and Conduction Noise

4.2.3 Case 31: The Filter of the Output Port will Influence the Conduction Noise of Input Port

4.2.4 Case 32: Properly using the Common-Mode Inductor to Solve the Test Problem for Radiation and Conduction Noise Immunity

4.2.5 Case 33: The Design of the Power Differential Mode Filter

4.2.6 Case 34: The Design of the Common-Mode Filter for Power Supply

4.2.7 Case 35: Whether More Filtering Devices Means Better Effects or Not

4.2.8 Case 36: The Events Should be Noticed When Arranging Filters

4.2.9 Case 37: How to solve the excessive harmonic currents of power

4.2.10 Case 38: The resistance and TVS in interface circuit affect protective performance.

4.2.11 Case 39: Can these surge protective devices parallel optionally?

4.2.12 Case 40: “Coordination” Must Be Noticed When Designing Surge Protection.

4.2.13 Case 41: The Lightning Protection Circuit Design and The Components Options must be Cogitated Carefully.

4.2.14 Case 42: There Is a Strict Rule about Anti-Thunder Device Installation.

4.2.15 Case 43: How to Choose TVS Pipe’s Clamping Batteries and Peak Power

4.2.16 Case 44: Choose Diode to Clamp or TVS to Protect

4.2.17 Case 45: Ferrite Bead and EFT / B Immunity

4.2.18 Case 46: Magnetic Beads How to Reduce the Radiation Emission of Switch Power Supply

Chapter 5 Bypassing and Decoupling

5.1 Introduction

5.1.1 The concept of decoupling, bypass and energy storage

5.1.2 Resonance

5.1.3 Impedance

5.1.4 Decoupling and bypass capacitor selection

5.1.5 Shunt capacitance

5.2 Analyses of related cases

5.2.1 Case 47: The influence of capacitance value size on power supply decoupling effect

5.2.2 Case 48: Bead’s and Decoupling Capacitors’ Location on Chip’s Current Pin

5.2.3 Case 49: How is the Electrostatic Discharge Interference Caused?

5.2.4 Case 50: Using Small Capacitance Can Solve the Problem that Has Plagued Us for Long

5.2.5 Case 51: How to Handle the Air Discharge Point of Metal-Clad Product

5.2.6 Case 52: Bypass Capacitance between ESD and Sensitive Signals

5.2.7 Case 53: Problems of Surge Test Caused by the Unsuitable Location of the Magnetic Bead

5.2.8 Case 54: The Role of the Bypass Capacitor

5.2.9 Case 55: Connections between Digital and Analog Ground at Both Ends of Optocouple

5.2.10 Case 56: Diodes and Energy Storage, Voltage Sag, Interrupt Immunity

Chapter 6 PCB Design and EMC

6.1 Introduction

6.1.1 PCB is a microcosm of a complete product

6.1.2 Loop is in everywhere of PCB

6.1.3 Crosstalk must be prevented

6.1.4 There are many antennas in the PCB.

6.1.5 The surface impedance in PCB has relationship with transient noise.

6.2 Analyses of related cases

6.2.1 Case 57: The Effect of Static Ground

6.2.2 Case 58: Loop Generated by PCB Wiring Cause Reset during ESD Test

6.2.3 Case 59: Unreasonable PCB Wiring Causes the Interface Damage by Lightning

6.2.4 Case60: How to Handle on the Ground at Both Sides of Common-Mode Inductor

6.2.5 Case 61: Avoid Coupling of “The Ground” and “The Power” When Placing

6.2.6 Case 62: Relationship between the Width of PCB Wiring and Magnitude of the Tested Surge Current

6.2.7 Case 63: How to Avoid Noise of Oscillator Transmitted to Cable Port

6.2.8 Case 64: Radiation Emission Caused by the Noise of Address Line

6.2.9 Case 65: The Interference Produced by Loop

6.2.10 Case 66: Installing Interlayer Spacing of PCB and EMI

6.2.11 Case 67: The Sensitive Line Arranged At the Edge of the PCB Is Susceptible to ESD Interference

6.2.12 Case 68: Reduce the Series Resistance in the Signal Line can Make the Test Pass

6.2.13 Case 69: PCB Mixed-Signal Circuits Design Detailed Analysis Case

6.2.14 Case 70: Why Oscillator cannot be Placed at PCB Edge

6.2.15 Case 71: Why Should Strong Radiator be Arranged in the Bottom of the Local Ground Plane

6.2.16 Case 72: Interface Wiring and Anti-ESD Interference Ability

Chapter 7 Components, Software and Frequency Jitter Technique

7.1 Devices, software and EMC

7.2 Frequency jitter technique and EMC

7.3 Analyses of related cases

7.3.1 Case 73: The EMC characteristics of device and the effect on the performance of EMC from software system cannot be ignored

7.3.2 Case 74: Software and ESD Immunity

7.3.3 Case 75: Conduction Disturbance Problem Caused by Frequency Jitter Technology

7.3.4 Case 76: The Circuit Design and Software Problem Rised from Voltage Drop and Interruption Test

Appendix A EMC Terms

Appendix B EMC Tests in Relevant Standard for Civil, Industry, Science, Medical, Railway and etc.

Appendix C EMC Test for Automotive Electronic and Electrical Components

Appendix D Military standard commonly used for EMC test

Appendix E EMC Standards and Certification

Index