비피기술거래  | 비피기술거래

54,000원  | 20170427  | 9791187327981

[스퍼터(Sputter) 및 스퍼터링(Sputtering)]은 최근 스퍼터링 산업분야에서 활용되는 기술, 스퍼터링 기술 관련 기업 및 시장동향을 조사ㆍ정리하고자 하였다. 본보고서는 먼저 현재 스퍼터링 기술의 종류와 원리 및 장단점을 한국전자통신연구원 및 국가행융합연구소 등 국공립 연구기관과 스퍼터링 기술을 개발ㆍ사용하는 국내외 업체들에 대해 스퍼터링 기술을 정리하고 소개하고자 한다.

 | KS OmniScriptum Publishing

173,250원  | 20111108  | 9783838125947

Since more than one decade large efforts are put worldwide into the development of a high-density nuclear fuel on the basis of metallic U-Mo alloys with Al cladding. Today, improved U-Mo/Al fuel designs have proven to perform reliably in the whole required range of in-pile conditions, and a qualified U-Mo nuclear fuel seems to be only a few steps away.

Depla, D. (EDT)/ Mahieu, S. (EDT)  | Springer

577,480원  | 20090801  | 9783540766629

The use of thin films is continuously expanding. In the family of Physical Vapour Deposition techniques, sputtering is one of the most important over the past 40 years. In this book, all aspects of the reactive magnetron sputtering process, from the discharge up to the resulting thin film growth, are described in detail, allowing the reader to understand the complete process.

Kiyotaka Wasa, Shigeru Hayakawa  | Noyes

0원  | 20090818  | 9780815512806

A concise, comprehensive overview of sputter deposition technology, a key technology for materials research in the next decade. Cathode sputtering is widely used in the microelectronics industry for silicon integrated circuit production, and for metallurgical coatings. High temperature superconductors can be synthesized with sputtering under non-equilibrium conditions. Diamond films and ferroelectric materials are other applications.

Kiyotaka Wasa  | Elton Wolf Pub

266,170원  | 20130110  | 9781437734836

Faetures a team of contributing authors with backgrounds specializing in the various new applications of sputtering technology. This book introduces the fundamentals of thin films and sputtering deposition, explores the theory and practices of this field, and also covers new technology such as nano-functional materials and MEMS.