| AuthorHouse

36,730원  | 20200323  | 9781728356938

Whatever our calling in life, our Christian faith should be evident in what we say and what we do; our world view should be crystal clear. Those who know me, expect my books to be about leadership, organizational performance, and high performance teams. This book is about taking our faith to work. There is nothing special about me; that is the point.

Auble, Stevi  | David & Charles

31,130원  | 20170922  | 9781446306604

Learn how to use easy papercraft techniques on cakes with edible wafer paper to create stunning cake designs.

카렌 A. 라인하르트, 베르너 컨  | 씨아이알

46,800원  | 20200520  | 9791156108412

웨이퍼 세정의 바이블! 웨이퍼 세정기술 제3판에서는 반도체 분야에서 활용되는 세정, 에칭 및 표면처리 기술에 대해서 심도 깊은 논의를 수행하였다. 표면과 콜로이드를 포함하는 습식처리 및 플라스마 처리와 관련된 기초물리학과 기초화학에 대한 내용도 포함되어 있다. 이 개정판에서는 발전을 거듭하고 있는 반도체 업계에서 최근 10년간 이루어진 새로운 기술과 소재들에 대해서도 다루고 있다. 이 책에서는 다양한 기술들과 결과에 대한 예시를 통해서 세정과 표면처리에 사용되는 공정들이 선정된 이유를 이해할수 있다. 독자들은 또한 오염을 평가하는 분석방법들에 대해서도 이해할 수 있다. 이 책은 세정의 이론과 기법에 대한 이해를 필요로 하는 관리자, 엔지니어 및 기술자들에게 소중한 지침서이다. 이 책에서는 입자, 유기물 그리고 금속오염 제거, 표면 부동화, 표면분석, 식각 그리고 감광제 박리와 같은 주제들을 다루고 있다. 이 책의 특징은 다음과 같다. ㆍ집적회로 제조에 사용되는 습식, 플라스마 및 여타의 표면처리기법을 포함한 세정기술에 초점을 맞추었다. ㆍ집적회로 제조에 사용되는 표면세정과 관련된 믿을 만한 레퍼런스들을 제공하고 있다. ㆍ식각, 세정 및 표면처리에서 필요로 하는?공정, 장비 및 계측 기술에 대한 새로운 문헌들과 기술의 변화동향 다루고 있다. 이 책은 화학공학이나 재료공학을 전공한 학생이나 엔지니어들뿐만 아니라 공정을 관리하고 장비를 개발하는 기계공학 및전자공학 엔지니어들에게도 훌륭한 지침서로 사용될 것이다.

 | CRC Press

0원  | 19860101  | 9780852744970

This book, the first to deal wholly with the topic of wafer scale integration, is the edited proceedings of a workshop held at the University of Southampton in July 1985. As the first international meeting held on this subject it attracted many participants from Europe and the United States. The meeting was particularly timely as there has recently been a renewed interest in research and commercial exploitation of wafer scale integration. The papers presented in the book cover the whole range of topics important in wafer scale integration, beginning with a critical review of fault-tolerant chips and wafer scale integration. Sections on general problems and interconnection strategies follow. There are then six papaers on architectures and four on restructurable very large scale integration. The book concludes with three reviews of different aspects of testability.

 | Springer Nature

173,230원  | 20181216  | 9789811342660

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.

 | LAP Lambert Academic Publishing

112,000원  | 20250201  | 9786208427177

The main aim of our project was to formulate and characterize nicotine wafer formulation as an alternate NRT. Millions of people have died and suffered from various diseases like cancer, stroke, blindness, heart problem, and many other chronic diseases by the consumption of raw tobacco and smoking cigarettes.We have developed a nicotine wafer formulation as a type of nicotine replacement therapy (NRT) to aid in smoking cessation.

Sherer, J. Michael  | CRC

438,180원  | 20050722  | 9781574447200

Given the myriad exhaust compounds and the corresponding problems they can pose in an exhaust management system, the proper choice of such systems is a complex task. Presenting the fundamentals, technical details, and general solutions to real-world problems, this book offers guidance on selecting an appropriate system for a given application.

Wafer, Francis M./ Wells, Cheryl A. (EDT)  | McGill Queens

50,150원  | 20210101  | 9780773533813

Francis M Wafer joined the Union's army of the Potomac as an assistant surgeon. From the battle of the Wilderness to the closing campaigns, Wafer was both participant and chronicler of the American Civil War. This book offers a collection of his diary entries during the war, his letters home, and the memoirs he wrote after returning to Canada.

Lau, John H.  | Springer

244,980원  | 20180510  | 9789811088834

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP ? such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. ? are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

Manish, Keswani  | VDM Verlag

133,000원  | 20160315  | 9783639090307

Megasonic cleaning is routinely used in the semiconductor industry to remove particle contaminants from wafer and mask surfaces. Cleaning is achieved through proper choice of chemical solutions, power density & frequency of acoustic field. Considerable work has been done to increase the understanding of particle removal mechanisms in megasonic cleaning using different solution chemistries with varying ionic strengths.

Tan, Chuan Seng (EDT)/ Gutmann, Ronald J. (EDT)/ R  | Springer

297,480원  | 20080919  | 9780387765327

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

 | 5starcooks

0원  | 20190807  | 9780655843825

How is Semiconductor Silicon Wafer data gathered? Can you maintain your growth without detracting from the factors that have contributed to your success? Does the Semiconductor Silicon Wafer task fit the client's priorities? Who pays the cost? Are losses recognized in a timely manner? This powerful Semiconductor Silicon Wafer self-assessment will make you the principal Semiconductor Silicon Wafer domain standout by revealing just what you need to know to be fluent and ready for any Semico

 | A.B.C. Editions

38,920원  | 20220430  | 9782957028634

A cookbook of savoury and sweet recipes for wafer-thin crackers and cookies

 | KS OmniScriptum Publishing

115,500원  | 20110515  | 9783844381115

Machining of single crystal silicon is a challenging and expensive affair due to the high hardness and inherent brittleness of the material. Major problem in conventional machining of brittle materials like silicon is the generation of cracks and subsurface damages. This book outlines a ductile mode machining process developed for silicon employing high speed end milling using diamond coated tools.

Reinhardt, Karen A. (EDT)/ Kern, Werner (EDT)  | William Andrew

418,700원  | 20080315  | 9780815515548

Intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits, this handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. It covers both the process and the equipment.