New Approaches to Image Processing Based Failure Analysis of Nano-Scale ULSI Devices (Paperback)

1. Preface
2. Introduction
2.1 Basics of Image Processing
2.2 The Problems of Shrinking Feature Size in ULSI Development and Failure Analysis
2.3 High Resolution Imaging of Metallic Structures
2.4 High Resolution Imaging of Non-Metallic Structures
2.5 Fabrication techniques in ULSI industry
3. New Image Processing Methods for Advanced Metallization in Micro- and Nano-Electronics
3.1 Characteristics of Metal Ultra-Thin Films Microstructures
3.2 Methods Based on Sample and Imaging System Knowledge
3.3 Methods Based on Microstructure Grain Size and Shape Range Knowledge
3.4 Increased Productivity by Obviating Steps of Selection of Measurement Conditions
3.5 Demonstration of Method Capabilities
3.5.1 Demonstration on Blurred HRSEM Images of Copper and Silver Films Microstructures
3.5.2 Demonstration on Indistinct Images of Filled Trenches and Vias
4. New Super Resolving Techniques and Methods for Micro-Electronics
4.1 The basics of super resolution
4.1.1 Introduction
4.1.2 Super resolving hardware
4.1.3 Super resolving numerics
4.2 Numerical Approaches for super resolved imaging
4.2.1 High-Resolution Layout Image Transform
4.2.2 Low Resolution Image Transform (Experiment-based)
4.2.3 Results of the Comparison
4.3 Radon based super resolved imaging
4.4 Numerical approaches for characterization of ULSI circuits
4.5 Applications in Failure Analysis
4.6 Applications in Manufacturing and Testing