Introduction to Microdisplays (Hardcover)

Series Editor’s Foreword.

Preface.

1. Introduction.

1.1 Microdisplays.

1.2 Human Factors.

1.3 Display Specifications.

1.4 Displays in General.

1.5 Microdisplay Evolution.

1.6 Microdisplay Applications.

2 Electronic Addressing.

2.1 Introduction.

2.2 MOS Transistor.

2.3 LCOS System Electronics Architecture.

2.4 Analogue Pixel Drive Schemes for Analogue Electro-Optic Response.

2.5 Digital Electronic Drive Schemes for Analog Electro-Optical Response.

2.6 Digital Pixel Drive Schemes for Binary Electro-Optical Response.

2.7 DMD Microdisplay Circuit.

2.8 OLED Microdisplay Circuits.

2.9 Photo-Addressing.

3 Silicon Backplane Technology.

3.1 Introduction.

3.2 CMOS Technology.

3.3 CMOS for microdisplays.

3.4 Wafer and die bow.

3.5 Surface planarization.

3.6 Pixel storage.

3.7 Light blocking.

3.8 Mirror quality.

3.9 Pixel gap fill.

3.10 LC Cell gap.

3.11 LCoS CMOS summary.

3.12 Backplane technology for other microdisplays.

3.13 Silicon Technology Roadmap.

3.14 Cost of silicon.

3.15 Summary.

4 Transmission Microdisplays Structure.

4.1 Background.

4.2 Thin film transistors.

4.3 Polysilicon.

4.4 Polysilicon microdisplay.

4.5 Transferred silicon.

4.6 Silicon-on-sapphire.

5 Transmission Liquid Crystal Microdisplays.

5.1 Introduction.

5.2 TFT-LCD.

5.3 Projection System.

5.4 Twisted-Nematic Cells.

5.5 Vertically-Aligned Nematic (VAN) Cells.

5.6 Fringing Field Effect.

5.7 Liquid crystal ionic effects.

6 Reflective Liquid Crystal Microdisplays.

6.1 Introduction.

6.2 Normally Black Homeotropic Cell.

6.3 Normally White Homogenous Cell.

6.4 Reflective TN Cells.

6.5 Normally White 90^o MTN Cell.

6.6 Normally White 63.6^o MTN Cell.

6.7 Normally Black 63.6^o TN Cell.

6.8 Normally White 60^o MTN Cell.

6.9 Normally White 45^o MTN Cell.

6.10 Normally Black 45^o TN.

6.11 Finger-On-Plane Structure.

6.12 Scattering and Diffractive Microdisplays.

6.13 Ferroelectric Liquid Crystals.

7 LCD Assembly and Test.

7.1 Background.

7.2 Back end processing.

7.3 Assembly components.

7.4 Assembly methods.

7.5 Test.

8 Micromechanical Devices.

8.1 Background.

8.2 Digital Mirror Device.

8.3 Piezoelectric Micromirror.

8.4 Grating Light Valve.

8.5 Interference modulation.

8.6 Further development.

9 Emissive Microdisplays.

9.1 Introduction.

9.2 Organic Emissive Materials.

9.3 Device Construction & Manufacture.

9.4 Device Characteristics.

9.5 Color.

9.6 OLED Microdisplays.

9.7 Other Emissive Microdisplays.

9.8 Summary.

10 Projection Displays.

10.1 Background.

10.2 Throughput.

10.3 Laser and LED sources.

10.4 Arc Lamps.

10.5 Polarizing Optics.

10.6 Color management.

10.7 Schlieren projector.

10.8 Laser scanning.

10.9 Projector Performance.

11 Near-Eye Systems.

11.1 Background.

11.2 Magnification.

11.3 Field of View.

11.4 Microdisplay Factors.

11.5 Magnifiers.

11.6 Camera Viewfinder.

11.7 Head mounted displays.

11.8 Free-surface prisms.

11.9 Eyewear-based displays.

11.10 Light-guide System.

11.11 Wide field of view.

11.12 Portable Equipment.

Table of Symbols.