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· 제목 : Semiconductor Wafer Bonding: Science and Technology (Hardcover)
· 분류 : 외국도서 > 기술공학 > 기술공학 > 전자공학 > 반도체
· ISBN : 9780471574811
· 쪽수 : 320쪽
· 출판일 : 1998-12-07
· 분류 : 외국도서 > 기술공학 > 기술공학 > 전자공학 > 반도체
· ISBN : 9780471574811
· 쪽수 : 320쪽
· 출판일 : 1998-12-07
목차
Basics of Interactions Between Flat Surfaces.
Influence of Particles, Surface Steps, and Cavities.
Surface Preparation and Room-Temperature Wafer Bonding.
Thermal Treatment of Bonded Wafer Pairs.
Thinning Procedures.
Electrical Properties of Bonding Interfaces.
Stresses in Bonded Wafers.
Bonding of Dissimilar Materials.
Bonding of Structured Wafers.
Mainstream Applications.
Emerging and Future Applications.
Index.
