Quality Conformance and Qualification of Microelectronic Packages and Interconnects (Paperback)

Three-Dimensional Stacked Dies.

Cofired Ceramic Substrates.

Organic Laminated Substrates and Chip-on-Board.

High-Density Interconnects and Deposited Dielectrics.

Wire and Wirebonds.

Tape Automated Bonds.

Flip-Chip Bonds.

Device and Substrate Attachment.

Cases.

Leads.

Lead Seals.

Lid Seals.

Material and Product Evaluation Methods.

Rework Methods.

Bibliography.

Index.