Materials for Electronic Packaging (Hardcover)

Overview of materials for electronic packaging
Solderability fundamentals: role of microscopic processes
Determining the damaging strains which cause failure in lead tin solders
Fluxless soldering for microelectronic applications, The effect of microstructure on the bonding of metal/ceramic interfaces
The future of advanced composite electronic packaging
Low thermal expansion composite materials for electronic packaging
Electrically conducting polymer-matrix composites
Thick-film technology
Electroless copper for micropackaging and ultra large scale integrated circuit applications
Vacuum metallization for integrated circuit packages
Electrically conducting polymers and organic materials
Diamond films
Measurements of properties of materials in electronic packaging