Cooling of Electronic Systems (Hardcover, 1994)

to ASI on Cooling of Electronic Systems.- Trends in the Packaging of Computer Systems.- Beyond Thermal Limits in Computer Systems Cooling.- Cooling Technology for High Performance Computers: Design Applications.- Cooling Technology for High Performance Computers: IBM Sponsored University Research.- Natural Convection Cooling of an Array of Heated Plates Simulating Printed Circuit Boards.- Convection in Arrays of Electronic Packages Containing Longitudinal Fin Heat Sinks.- Experiments on Natural Convective Air Cooling of a PCBs Array in a Closed Casing with Inclination.- Cooling of Multiple Heat Sources Attached to Two Dimensional Rectangular Fins.- Natural Convection Heat Transfer from Horizontal Rectangular Fin Arrays.- Cooling of a Microelectronic Sensor by Turbulent Forced Convection.- Computation of Steady Laminar Natural Convective Heat Transfer from Localized Heat.- Unsteady Forced Convection in a Duct with and without Array of Block-Like Electronic Components.- Optimal Geometry of Convection Cooled Electronic Packages.- A Thermal Design Approach for Electronic Equipment by use of a Personal Computer and Flow Visualization.- Experimental Visualization of Temperature Fields and Measurement of Heat Transfer Enhancement in Electronic System Models.- Cooling of Electronic Systems by Impinging Air Jets.- Numerical and Experimental Studies for the Conjugate Direct Cooling of a Micro Heat Generating Element.- The Cooling of Electronic Components with Flat Plate Heat Sinks.- Fundamentals of Nucleate Pool Boiling of Highly-Wetting Dielectric Liquids..- Single-Phase Liquid Jet Impingement Cooling of High-Performance Chips.- Application of Channel Flows to Single-Phase Liquid Cooling of Chips and Multi-Chip Modules.- Immersion Cooling of Digital Computers.- Boiling Coupled with Air Cooling.- Thermal Control for Cryogenically Cooled Computer Systems.- Thermal Contact Conductance-Theory and Applications.- Analysis of Extended Surface Arrays for Air-Cooled Electronic Equipment.- The Choking of Finned Arrays.- Error Analysis and Improved Formulations for Extended Surfaces.- Determination of the Weighted-Average Case Temperature for a Single Chip Package.- Network Modelling of Two-Phase Flow in Porous Structures: An Alternative for the Study of Chip Cooling Enhancement.- Accurate Temperature Prediction in Consumer Electronics: A Must but still a Myth.- Pragmatic Methods for Determining the Parameters Required for the Thermal Analysis of Electronic Systems.- Effective Heat Transfer Coefficients and Temperature Modelling in Electronic Systems.- Information Processing and Heat Transfer Engineering: Some Generic Views on Future Research Needs.- Research Needs in Thermal Management of Electronic Systems.