McM C/Mixed Technologies and Thick Film Sensors (Hardcover)

Preface. Technology of Multichip Modules. 3-D Interconnection Microsystems Applications; C. Val. High Performance Packaging with Multilayer Ceramic Modules; E. Bihler. High Frequency LTCC Modules, P. Johnsson, C. Vaktnas, N. Billstrom. Analysis and Optimization of Circuit Interconnect Performance; J. Peeters, E. Beyne. High Performance Interconnect on Cofired Ceramic; K. Kurzweil, D. Lambert. New Aspects in the Reliability Design of High Density Interconnects in MCMs; G. Harsanyi. MCM-D Technology with Active and Passive Substrates; H. Hentzell. High Performance Ceramic Modules and Packages; P. Danner. Laser Processing in MCM-C Technologies; Z. Illyefalvi-Vitez. LTCC Technology: Where we Are and Where we're Going; C.Q. Scrantom. Design and Realization of High Performance Ceramic Heat Sinks; E. Gambarte, M. Topfer, A. Paredes, M. Reill, M. Weichmann. A1N Cofired MCM-C/D; W.K. Jones, M.A. Zampino. Very Fine Line Photoimageable Thick Film Technology Developed at Hybridas, Lithuania; J. Minalgiene, S. Muckett. Applications of MCM-C or Mixed MCM Technologies. High-Performance Solid State Mass Memory Modules; A. Coello-Vera, P. d'Andrea. Mass Memory Packaging for Space Applications; J. de Givry. Advanced Multichip Modules for Telecom Applications; K. Losch, H.M. Rappold. Telecom Applications of MCM Technology; J.L. Conesa. Design and Realization of a Multichip Module as a Motion Estimator for HDTV-Applications; S. Fazelpour, R. Brodowski, R. Dumcke, H. Reichl, B. Bolike. Multi-Chip Module Applications in Satellite Communications; N. Sinnadurai. Material for MCM Applications. Materials/Design Considerations for MCMs; H.K. CharlesJr. MCMs: Material Choices for Electronics and Optoelectronics; N. Chandler, N.E. Sellars, R.K. Barton, S.J. Foster, P.D. Sleep, G.N. Blackie, I.R. Croston. Low Permittivity Porous Silica Thin Films for MCM-C/D Applications; R.A. Gerhardt, J.R. Kokan, P.A. Kohl. MCM Passivation Studies for Enhanced Producibility and Reliability; T.J. Sanders, C.R. Miller, K.E. Gsteiger, G.T. Hess, D. Nedunchellyan. Buried Thick Film Capacitors Built up with High-K Dielectrics for MCM-Applications; W. Smetana. Sensors Technology for MCM-C Technologies. Advances in Materials for Sensors; S. Mergui. PTC Thick Film Thermistors; J. Hormadaly, S.J. Horowitz, J.R. Larry, P. O'Callaghan. Evaluation of Some Thick Film Materials for Temperature, Force, and Humidity Sensors; M. Hrovat, D. Belavič, J. Holc. Parameters and Technology of Thick Film Electrolytic SO2 Sensors; L.J. Golonka. Sensors: a Great Chance for Microelectronic Technologies; R. dell'Acqua. High Sensitivity Thermometers for Millikelvin Temperature Range; M. Somora, D. Vanický, I. Baťka, K. Flachbart. Thick Films Based on Glass and Polymeric Matrices, Mechanism of Conductivity; I. Křivka, J. Kubat, R. Kužel, J. Prokeš. Author Index. Keyword Index.