Antenna-In-Package Technology and Applications (Hardcover)

Chapter 1:  Introduction
Yueping Zhang

Chapter 2: Antennas for AiP Technology
Yueping Zhang

Chapter 3: Package Technologies
Dr Ning Ye

Chapter 4: Electrical, Mechanical, and Thermal Co-Design
Xiaoxiong Gu and Pritish R Parida

Chapter 5: Antenna-in-Package Measurements
A.C.F. Reniers, U. Johannsen and A.B. Smolders

Chapter 6: Antenna-in-Package Designs in Multilayered Low Temperature Co-fired Ceramic (LTCC) Platforms
Atif Shamim, Haoran Zhang  

Chapter 7: Antenna Integration in Packaging Technology from 60 GHz up to 300 GHz (HDI-Based AiP)
Dr. Frédéric Gianesello, Dr. Diane Titz, and Prof. Cyril Luxey

Chapter 8: Antenna-in-Package Integration for Fan-Out WLP (FOWLP)
Maciej Wojnowski, Klaus Pressel

Chapter 9: 3D-Printing-Based AiP
Tong-Hong Lin, Ryan A. Bahr, Manos M. Tentzeris

Chapter 10: SLC-based AiP for Phased Array Applications
Dr. Duixian Liu, Xiaoxiong Gu

Chapter 11: 3D AiP for Power Transfer, Sensor Nodes, and IoT Applications
Dr. Amin Enayati*, Karin Mohammadpour‐Aghdam, Farbod Molaei‐Ghale