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· 분류 : 외국도서 > 기술공학 > 기술공학 > 전기공학
· ISBN : 9781402077333
· 쪽수 : 195쪽
목차
-List of Figures. List of Tables. -Preface. Acknowledgements. -1: Microelectronic Interconnections. 1. Signal transmission on interconnects. 2. On-chip interconnections. 3. Package level interconnections. -2: Interconnect Modeling. 1. Physical foundations for circuit models of interconnections. 2. Lossless transmission line model. 3. Loss transmission line model. 4. Optimum line model selection. -3: Crosstalk Effects in Digital Circuits. 1. Spurious signals. 2. Crosstalk induced delay. 3. Energy dissipation due to crosstalk. 4. Crosstalk effects in logic VLSI circuits. -4: Packaging Interconnects. 1. Packaging structure. 2. Lumped electrical parameter modeling of packages. 3. Circuit modeling from measurement. 4. Power distribution modeling from EM simulation. 5. Simulations of package effects. -5: Techniques for Avoiding Interconnection Noise. 1. The noise detection problem. 2. Brief introduction to the testing of logic circuits. 3. Crosstalk-induced spurious signal detection. 4. Other test techniques.