Iutam Symposium on Modelling Nanomaterials and Nanosystems: Proceedings of the Iutam Symposium Held in Aalborg, Denmark, 19-22 May, 2008 (Hardcover, 2009)

Preface; Multiscale Failure Modeling: From Atomic Bonds to Hyperelasticity with Softening, by K. I: Volokh; Crack Initiation, Kinking and Nanoscale Damage in Silica Glass: Multimillion-Atom Molecular Dynamics Simulation, by Y.C. Chen, K. Nomura, Z. Lu, R. Kalia, A. Nakano and P. Vashishta; Multiscale Modelling of Layered-Sficate/PET Nanocomposites during Solid-State Processing, by L.Figiel, F. P. E. Dunne and C.P Buckley; Modelling Transient Heat Conduction at Multiple Length and Time Scales: A Coupled Non-Equilibrium Molecular Dynamics/Continuum Approach, by K. Jolley and S. P. A. Gill; Multiscale Modeling of Amorphous Materials with Adaptivity, by V. B. C. Tan, M. Deng, T. E. Tay and K.M. Lim; Thermodynamically-Consistent Multiscale Constitutive Modeling of Glassy Polymer Materials, by P. K. Valavala and G. M. Odegard; Effective Wall Thickness of Single-Walled Carbon Nanotubes for Multiscale Analysis: The Problem and a Possible Solution, by L. C. Zhang and C. Y. Wang; Discrete-Continuum Transition in Modelling Nanomaterials, by R. Pyrz and B. Bochenek; Looking beyond Limitations of Diffraction Methods of Structural Analysis of Nanocrystalline Materials, by B. Palosz, E. Grzanka, S. Gierlotka, M. Wojdyr; W. Palosz, T. Proffen, R. Rich and S. Stelmakh; Multiscale Modelling of Mechanical Anisotropy of Metals, by G. Winther; Micromechanical Modeling of the Elastic Behavior of Multilayer Thin Films: Comparison with In Situ Data from X-Ray Diffraction, by G. Geandier, L. Gelebart, 0. Castelnau, E. Le Bourhis, P.-0. Renault, Ph. Goudeau and D. Thiaudiere; Two Minimisation Approximations for Joining Carbon Nanostructures, by D. Baowan, B. J. Cox, N. Thamwattana and J.M. Hill; On the Eigenfrequencies of an Ordered System of Nanoobjects, by V. A. Eremeyev and H. Altenbach; Monitoring of Molecule Adsorption and Stress Evolutions by In-Situ Microcantilever Systems, by H. L. Duan, Y. Wang and X. Yi; Using Thermal Gradients for Actuation in the Nanoscale, by E.R.Hernandez, R. Rurali, A. Barreiro, A. Bachtold, T. Takahashi,T. Yamamoto and K. Watanabe; Systematic Design of Metamaterials by Topology Optimization, by 0. Sigmund; Modeling of Indentation Damage in Single and Multilayer Coatings, by J. Chen and S. J. Bull; Reverse Hall-Petch Effect in Ultra Nanocrystalline Diamond, by Z.N. Remediakis, G. Kopidakis and P.C. Kelires; Elastic Fields in Quantum Dot Structures with Arbitrary Shapes and Interface Effects, by H. J. Chu, H. L. Duan, J. Wang and B. L. Karihaloo; Numerical Modelling of Nano Inclusions in Small and Large Deformations Using a Level-Set/Extended Finite Element Method, by J. Yvonnet, E. Monteiro, H. Le Quang and Q.-C. He; Thermo-Elastic Size-Dependent Properties of Nano-Composites with Imperfect Interfaces, by H.L. Duan, B.L. Karihaloo and J. Wang; Modeling the Stress Transfer between Carbon Nanotubes and a Polymer Matrix during Cyclic Deformation, by C.C. Kao and R. J. Young; Atomistic Studies of the Elastic Properties of Metallic BCC Nanowires and Films; P. A. T. Olsson and S. Melin; Advances Continuum-Atomistic Model of Materials Based on Coupled Boundary Element and Molecular Approaches, by T. Burczyriski, W Kui, A. Mrozek, R. Gbrski and G. Dziatkiewicz; Finite Element Modelling Clay Nanocomposites and Interface Effects on Mechanical Properties, by J.KH. Chia; Small Scale and/or High Resolution Elasticity, by I. Goldhirsch and C. Goldenberg; Multiscale Molecular Modelling of Dispersion of Nanoparticles in Polymer Systems of Industrial Interest, by M. Fermeglia and S. Pricl; Structural-Scaling Transitions in Mesodefect Ensembles and Properties of Bulk Nanostructural Materials. Modeling and Experimental Study, by O.B. Naimark and O.A. Plekhov; Modeling Electrospinning of Nanofibers, by T.A. Kowalewski, S. Barral and T. Kowalczyk; Use of Reptation Dynamics in Modelling Molecular Interphase in Polymer Nano-Composite, by J. Jancar; Appendix 1 : Presentations without Paper; Appendix 2: Scientific Program;