Area Array Interconnection Handbook (Paperback)

1. History of Flip Chip and Area Array Technology. Part I: Area Array Die and Interconnection Technology. 2. Wafer Bumping. 3. Wafer-Level Test. 4. Known Good Die (KGD) 5. Wafer Finishing - Dicing, Picking, Shipping. 6. Ceramic Chip Carriers. 7. Laminate/HDI Carriers. 8. Flip-Chip Die Attach Technology. 9. Soldier Bump Flip-Chip Replacement Technology on Ceramic Carriers. 10. Manufacturing Considerations and Tools for Flip Chip Assembly. 11. Test and Burn-In Sockets. 12. Underfill: The Enabling Technology for Flip-Chip Packing. 13. Reliability of Die-Level Interconnections 14. Ceramic and Plastic Pin Grid Array Technology. 15. Plastic Ball Grid Arrays (PBGA) 16. Tape Ball Grid Array. 17. Ceramic Ball and Column Grid Arrays. 18. Chip Scale Package Technology. 19. Assembly of Area Array Components. 20. Area Array Replacement Technology. 21. Product Connector Technology. 22. Board-Level Area Array Interconnect Reliability. 23. Chip Scale Package Assembly Reliability. 24. Area Array Design Principles. 25. Area Array Leverages: Why and How to Choose a Package. 26. Interconnections for High Frequency Applications. 27. Thermal Performance. 28. Metallurgical Factors. References.