Design of 3D Integrated Circuits and Systems (Hardcover)

Preface

About the Editors

Contributors

3D Integration Technology with TSV and IMC Bonding; Katsuyuki Sakuma

Wafer-Level Three-Dimensional ICs for Advanced CMOS Integration; Ronald J. Gutmann and Jian-Qiang Lu

Integration of Graphics Processing Cores with Microprocessors; Deepak C. Sekar and Chinnakrishnan Ballapuram

Electrothermal Simulation of Three-Dimensional Integrated Circuits; Shivam Priyadarshi, Jianchen Hu, Michael B. Steer, Paul D. Franzon, and W. Rhett Davis

Thermal Management in 3D ICs/Systems; Francesco Zanini

Emerging Interconnect Technologies for 3D Networks-on-Chip; Rohit Sharma and Kiyoung Choi

Inductive-Coupling ThruChip Interface for 3D Integration; Noriyuki Miura and Tadahiro Kuroda

Fabrication and Modeling of Copper and Carbon Nanotube-Based Through-Silicon Via; Brajesh Kumar Kaushik, Manoj Kumar Majumder, and Archana Kumari

Low-Power Testing for 2D/3D Devices and Systems; Xijiang Lin, Xiaoqing Wen, and Dong Xiang