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Semiconductor Devices in Harsh Conditions

Semiconductor Devices in Harsh Conditions (Hardcover)

Kirsten Weide-Zaage, Malgorzata Chrzanowska-Jeske (엮은이)
CRC Press
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Semiconductor Devices in Harsh Conditions
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책 정보

· 제목 : Semiconductor Devices in Harsh Conditions (Hardcover) 
· 분류 : 외국도서 > 기술공학 > 기술공학 > 기계공학
· ISBN : 9781498743808
· 쪽수 : 234쪽
· 출판일 : 2016-11-21

목차

Contents Foreword................................................................................................................ vii Preface.......................................................................................................................ix Editors......................................................................................................................xv Contributors......................................................................................................... xvii Section I Radiation 1. Commercial Off-the-Shelf Components in Space Applications............3 Stefano Esposito and Massimo Violante 2. Soft Errors in Digital Circuits Subjected to Natural Radiation: Characterisation, Modelling and Simulation Issues............................. 21 Daniela Munteanu and Jean-Luc Autran 3. Simulation of Single-Event Effects on Fully Depleted Siliconon- Insulator (FDSOI) CMOS......................................................................43 Walter Calienes Bartra, Andreas Vladimirescu and Ricardo Reis Section II Sensors and Operating Conditions 4. Electronic Sensors for the Detection of Ovarian Cancer...................... 69 A. M. Whited and Raj Solanki 5. Sensors and Sensor Systems for Harsh Environment Applications......................................................................87 Andrea De Luca, Florin Udrea, Guoli Li, Yun Zeng, Nicolas Andre, Guillaume Pollissard-Quatremere, Laurent A. Francis, Denis Flandre, Zoltan Racz, Julian W. Gardner, Shan Zee Ali, Octavian Buiu, Bogdan C. Serban, Cornel Cobianu and Tracy Wotherspoon 6. III-Nitride Electronic Devices for Harsh Environments..................... 111 Shyh-Chiang Shen Section III Packaging and System Design 7. Packaging for Systems in Harsh Environments................................... 135 Marc Christopher Wurz and Susanne Bengsch 8. Corrosion Resistance of Lead-Free Solders under Environmental Stress................................................................................. 149 Suhana Mohd Said and Nor Ilyana Muhd Nordin 9. From Deep Submicron Degradation Effects to Harsh Operating Environments: A Self-Healing Calibration Methodology for Performance and Reliability Enhancement........................................... 167 Eric J. Wyers and Paul D. Franzon 10. Role of Diffusional Interfacial Sliding during Temperature Cycling and Electromigration-Induced Motion of Copper Through Silicon Via.................................................................................... 197 Lutz Meinshausen, Ming Liu, Indranath Dutta, Tae-Kyu Lee and Li Li

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Kirsten Weide-Zaage (엮은이)    정보 더보기
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Malgorzata Chrzanowska-Jeske (엮은이)    정보 더보기
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