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Next-Generation Adcs, High-Performance Power Management, and Technology Considerations for Advanced Integrated Circuits: Advances in Analog Circuit De

Next-Generation Adcs, High-Performance Power Management, and Technology Considerations for Advanced Integrated Circuits: Advances in Analog Circuit De (Hardcover, 2020)

Andrea Baschirotto, Pieter Harpe, Kofi A. A. Makinwa (엮은이)
Springer International Publishing
276,030원

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Next-Generation Adcs, High-Performance Power Management, and Technology Considerations for Advanced Integrated Circuits: Advances in Analog Circuit De
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책 정보

· 제목 : Next-Generation Adcs, High-Performance Power Management, and Technology Considerations for Advanced Integrated Circuits: Advances in Analog Circuit De (Hardcover, 2020) 
· 분류 : 외국도서 > 기술공학 > 기술공학 > 전자공학 > 회로
· ISBN : 9783030252663
· 쪽수 : 324쪽
· 출판일 : 2019-11-11

목차

Part I. Next-Generation ADCs.- Chapter 1. Emerging ADCs.- Chapter 2. Noise-Shaping SAR ADCs.- Chapter 3. Efficient High-Resolution Nyquist ADCs.- Chapter 4. Continous-Time ADCs for Automative Applications.- Chapter 5. Continuous-Time Delta-Sigma Converters With Finite-Impulse-Response (FIR) Feedback.- Chapter 6. High-speed ADCs for Wireless Base-Stations.- Part II. High-Performance Power Management.- Chapter 7. Advanced Multiphasing: Pushing the Limits of Fully Integrated Switched-Capacitor Converters.- Chapter 8. Highly-Efficient Power Management in Wearables and IoT Devices.- Chapter 9. Current Sensing Techniques: Principles and Readouts.- Chapter 10. Wide Bandgap Integrated Circuits for High Power Management in Extreme Environments.- Chapter 11. On the Limits of Driving Wide-Bandgap Transistors.- Chapter 12. Challenges in Driving New Generations of Power Switches for Motor Drive: A dV/dt Self-Adjusting Architecture for Superjunction Power Devices.- Part III. Technology Considerations for Advanced IC.- Chapter 13. Silicon Technologies for the Next Age of Wireless Connectivity.- Chapter 14. IC Technologies for mm-Wave Applications.- Chapter 15. Accuracy: The Next Opportunity for MEMS.- Chapter 16. Robustness, Reliability and Diagnostic Aspects in Sensors for Automotive Applications: The Magnetic Sensors Case.- Chapter 17. Rad-Hard Mixed-Signal IC Design, Theory and Implementation.- Chapter 18.1-GRad-TID Effects in 28-nm Device Study for Rad-Hard Analog Design.

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