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· 분류 : 외국도서 > 기술공학 > 기술공학 > 전자공학 > 회로
· ISBN : 9783319793054
· 쪽수 : 339쪽
· 출판일 : 2018-05-26
목차
Introduction to Electrical 3D Integration.- Copper-based TSV - Interposer.- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization.- Energy Efficient Electrical Intra-Chip Stack Communication.- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks.- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver.- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications.- Accurate Temperature Measurement for 3D Thermal Management.- EDA Environments for 3D Chip Stacks.- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias.- Introduction to Optical Inter- and Intraconnects.- Optical Through-Silicon Vias.- Integrated Optical Devices for 3D Photonic Transceivers.- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators.- Athermal photonic circuits for optical on-chip interconnects.- Integrated Circuits for 3D Photonic Transceivers.- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-














