Carbon Nanotubes for Interconnects: Process, Design and Applications (Paperback)

Interconnect challenges for 2D and 3D Integration.- Overview of Carbon Nanotube Physical Properties.- Overview of Carbon Nanotube Processing Methods.- Electrical Conductivity of Carbon Nanotubes - Modeling and Characterization.- Computational Studies of Thermal Transport Properties of Carbon Nanotube Material.- Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects.- Carbon Nanotubes as Vertical Interconnects for 3D ICs.- Carbon Nanotubes as Micro-Bumps for 3D Integration.- Electrothermal Modeling of Carbon Nanotubes TSVs.- Exploring Carbon Nanotubes for 3D Power Delivery Networks.- Carbon Nanotubes for Monolithic 3D ICs.