Key enabling technologies for future wireless, wired, optical and satcom applications (Hardcover, 1)

Preface Editors’ biography List of Contributors List of Figures List of Tables ? B55X: A SHIFT in STMicroelectronics BiCMOS Technologies, Pascal Chevalier, Alexis Gauthier, Nicolas Guitard, Victor Milon, Frederic Monsieur, Nicolas Derrier, Claire Deglise-Favre, Didier Celi, Cedric Durand, Ophelie Foissey, Florence Sonnerat, Fredric Gianesello, Daniel Gloria ? RF advanced substrates for 5G advanced and 6G, Yvan Morandini ? Advanced substrates technologies for Sub-THz era, Francois Brunier ? The impact of irradiation on DC characteristics and Low Frequency Noise of advanced SiGe:C HBTs, Bruno Sagnes, Ayenew Adebabay Belie, Menel Bouhouche, Jonny El Beyrouthy, Fabien Pascal, Jerome Boch, Pascal Chevalier, Daniel Gloria ? Decarbonizing the electronics industry to achieve Net Zero, Gunther Walden ? A multi-standard RF Bandpass Sigma-Delta ADC, Hassan Aboushady ? Analog Multiplexing for Bandwidth and Sampling Rate Multiplication of Digital-Analog-Converters in Coherent Optical Transmission Systems, Oliver Hauck, Fred Buchali, Michael Collisi, Michael Moller ? E-band & D-band VCOs: distributed tank design methodology, bufferless approach, Leonardo Gomes ? Challenges for 2.5D and 3D integration of InP HBT technology, Bertrand Ardouin ? Analysis of Quasi-Coaxial Via implemented in IC Substrate using Multiple Scattering Method, Hiroaki Takahashi, Pelin Suealp, Erich Schlaffer ? D-Band Phased Array Devices and Modules for B5G Backhaul, Alessandro Fonte, Stefano Moscato, Riccardo Moro, Andrea Pallotta, Andrea Mazzanti, Andrea Bilato, Guglielmo De Filippi, Lorenzo Piotto, Francesco Centurelli, Pietro Monsurro, Hassan Sadeghi Chameh, Pasquale Tommasino, Alessandro Trifiletti, Daniele Lodi Rizzini, Francesco Tesolin, Simone Mattia Dartizio, Salvatore Levantino ? Sub-THz transceiver design for future generation mobile communications, Giovanni Mangraviti ? Ka-Band GaN-on-SiC Power Amplifier for High EIRP Satellite Phased Antenna Array, Francesco Manni, Paolo Colantonio, Rocco Giofre, Ernesto Limiti, Patrick Ettore Longhi, Steven Mejillones Caicedo, Stefano Moscato, and Alessandro Fonte Appendix ? InP-on-Si Technologies For Next Generation Optical Communication High-Speed Analog Front-Ends, Romain Hersent ? 150nm Gallium Nitride on Silicon Carbide Technology for High Power 5G New Radio Applications, Kimon Vivien ? Post-process substrate porosification for RF applications, Joff Derluyn ? D-band modulated signal generation using photonics techniques, Guillaume Ducournau ? D-Band RF architecture for Beyond 5G wireless networks: specifications, challenges, and Key Enabling Technologies, Cedric Dehos ? 2.5D, 3D assembly technologies for RF, mmW and sub-THz heterogeneous systems, Olivier Valorge ? Heterointegration approaches for InP-HBT technologies for 5G applications and beyond, Hady Yacoub ? RF-Heterointegration at Wafer-level and Panel-level for mm-wave Applications, Siddhartha Sinha ? SiGe BiCMOS & III-V technologies heterogeneous Integration challenges, Frederic Gianesello ? Advanced Packaging Solutions for mmWave Applications, Tanja Braun ? Modular 3D mmW and THz packaging concepts and technologies, Mikko Varonen ? LDS and AMP processes for RF antenna in package AiP applications in the E and D-band, Abdel Hadi Hobballah ? Sub-THz Antenna and Package Integration for Miniaturized Surface Mount Device Modules, Akanksha Bhutani