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· 제목 : Heterogeneous Integrations (Hardcover, 2019)
· 분류 : 외국도서 > 기술공학 > 기술공학 > 전자공학 > 회로
· ISBN : 9789811372230
· 쪽수 : 368쪽
· 출판일 : 2019-04-12
· 분류 : 외국도서 > 기술공학 > 기술공학 > 전자공학 > 회로
· ISBN : 9789811372230
· 쪽수 : 368쪽
· 출판일 : 2019-04-12
목차
Chapter 1. Overview of 3D IC Heterogeneous Integrations.- Chapter 2. RDLs for Heterogeneous Integrations on Organic Substrates.- Chapter 3. RDLs for Heterogeneous Integration on Silicon (TSV-Interposers).- Chapter 4. RDLs for Heterogeneous Integration on Silicon (Bridges).- Chapter 5. RDLs for Heterogeneous Integration on Fan-Out Substrates.- Chapter 6. 3D IC Heterogeneous Integration in Memory Stacking.- Chapter 7. 3D IC Heterogeneous Integration in PoP Formats.- Chapter 8. 3D IC Heterogeneous Integration in Chip-to-Chip Formats.- Chapter 9. 3D IC Heterogeneous Integration with LED and VCSEL.- Chapter 10. Future Trends of 3D IC Heterogeneous Integrations.
