3D Integration for VLSI Systems (Hardcover)

3D Integration Technology ? Introduction and Overview
Chuan Seng Tan, Kuan-Neng Chen and Steven J. Koester
A Systems Perspective on 3D Integration: What is 3D? And What is 3D Good For?
Phil Emma and Eren Kursun
Wafer Bonding Techniques
Bioh Kim, Thorsten Matthias, Viorel Dragoi, Markus Wimplinger and Paul Lindner
TSV Etching
Paul Werbaneth
TSV Filling
Arthur Keigler
3D Technology Platform: Temporary Bonding and Release
Mark Privett
3D Technology Platform: Wafer Thinning, Stress Relief, and Thin Wafer Handling
Scott Sullivan
Advanced Die-to-Wafer 3D Integration Platform: Self-Assembly Technology
Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka and Mitsumasa Koyanagi
Advanced Direct Bond Technology
Paul Enquist
Surface Modification Bonding at Low Temperature for Three-Dimensional Hetero-Integration
Akitsu Shigetou
Through Silicon Via Implementation in CMOS Image Sensor Product
Xavier Gagnard and Nicolas Hotellier
A 300-mm Wafer-Level Three-Dimensional Integration Scheme Using Tungsten Through- Silicon Via and Hybrid Cu-Adhesive Bonding
Fei Liu
Power Delivery in 3D IC Technology with a Stratum Having an Array of Monolithic DC-DC Point-of-Load (PoL) Converter Cells
Ron Rutman and Jian Sun
Thermal-Aware 3D IC Designs
Xiaoxia Wu, Yuan Xie and Vijaykirshnan Narayanan
3D IC Design Automation Considering Dynamic Power and Thermal Integrity
Hao Yu and Xiwei Huang
Outlook
Ya Lan