| Repro Books Limited

18,350원  | 20211218  | 9798885460132

Short biography of Rohit Sharma and about life.During writing this book no character & no religious are harmed written by Mr Vivek Kumar Pandey. winner youngest writer award 1st rank in india 2020.He is only one writer can publish 700+ own book that was greatest successfull in his life .

 | Repro Books Limited

36,730원  | 20211218  | 9798885309875

Short biography of Rohit Sharma and about life.During writing this book no character & no religious are harmed written by Mr Vivek Kumar Pandey. winner youngest writer award 1st rank in india 2020.He is only one writer can publish 700+ own book that was greatest successfull in his life . This book fully colour edition books.

Sharma, Rohit (EDT)  | Taylor & Francis

389,800원  | 20141112  | 9781466589407

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal-oxide-semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Kumar, Raghvendra, Sharma, Rohit, Pattnaik, Prasant Kumar  | Springer

367,480원  | 20210103  | 9789811579646

It bridges the gap between multimedia concepts and solutions by providing the current IOT frameworks, their applications in multimedia analysis, the strengths and limitations of the existing methods, and the future directions in multimedia IOT analytics.

Sharma, Rohit, Mahapatra, Rajendra Prasad, Cengiz, Korhan  | CRC Press

345,250원  | 20201210  | 9780367260439

This book will focus on RFID (Radio Frequency Identification), IoT (Internet of Things), and WSN (Wireless Sensor Network). It will include contributions that discuss the security and privacy issues as well as the opportunities and applications that are tightly linked to sensitive infrastructures and strategic services.