Tsv 3D RF Integration: High Resistivity Si Interposer Technology (Paperback)

1. Introduction to HR-Si Interposer Technology 2. Design, process and electrical verification of HR-Si interposer 3. Design, verification and optimization of novel vertical RF transmission structure in HR-Si interposer 4. HR-Si TSV integrated inductor 5. Verification of 2.5D/3D heterogeneous RF integration of HR-Si interposer 6. 3D heterogeneous RF integration oriented HR-Si interposer embedded with microchannel 7. Patch Antenna in Stacked HR-Si interposers 8. Through Glass Via Technology 9. Conclusion and outlook