Introduction to Microsystem Packaging Technology (Hardcover)

Introduction
What are Microsystems
Related Fundamentals of Microsystems
What is Microsystems Packaging
What is Microelectronics Packaging
History of Microelectronics Packaging
Status and Function of Microsystems Packaging Technology
Technical Challenges in Microsystems Packaging

Design Technique for Microsystems Packaging and Integration
Electrical Design
Thermal Management Design
Mechanical Design
Microfluidic Design
Multi-disciplinary Design

Substrate Technology
Organic Substrate
Ceramic Substrates
Introduction of Typical Ceramic Substrates
LTCC Substrates
Advanced Substrates

Interconnection Technology
Braze-Welding Technology
Wire Bonding Technology
Tape Automated Bonding Technology
Flip-Chip Bonding Technology
Chip Interconnection in System-level Packaging
Advanced interconnection

Device Level Package
Metal Package
Plastic Package
Ceramic Package
Typical Examples of Device-level Package
Development Prospect

MEMS Packaging
Function of MEMS Packaging
Device Level Package for MEMS
Wafer Level Package for MEMS
Sealing Techniques
Thin Film Encapsulation
Vacuum Packaging for MEMS
Case StudyA 3D Wafer Level Hermetical Packaging for MEMS

Module Assembly and Optoelectronic Packaging
Surface Mount Technology
Packaging of Flat Panel Display Modules
Optoelectronic Packaging

System Level Packaging Technology
Overview
System on Chip Technology
System in Package Technology
RF System Package Technology

Reliability
Fundamentals of Reliability Methodology
Wafer and Packaging-related Failure Mode and Mechanisms
Reliability Qualification and Analysis
Summary

Prospects for Microsystems Packaging Technology
Evolvement of Packaging Materials
Evolvement and Application of Packaging Technologies
Evolution of Packaging Technologies and Environmental Protection
Conclusion Remarks
References