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· 분류 : 외국도서 > 기술공학 > 기술공학 > 전자공학 > 마이크로 일렉트로닉스
· ISBN : 9780387782188
· 쪽수 : 724쪽
· 출판일 : 2008-12-10
목차
3D Integration Technologies - An Overview.- Advanced Bonding/Joining Techniques.- Advanced Chip-to-Substrate Connections.- Advanced Wire Bonding Technology: Materials, Methods, and Testing.- Lead-Free Soldering.- Thin Die Production.- Advanced Substrates: A Materials and Processing Perspective.- Advanced Print Circuit Board Materials.- Flip-Chip Underfill: Materials, Process and Reliability.- Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips.- Electrically Conductive Adhesives (ECAs).- Die Attach Adhesives and Films.- Thermal Interface Materials.- Embedded Passives.- Nanomaterials and Nanopackaging.- Wafer Level Chip Scale Packaging.- Microelectromechanical Systems and Packaging.- LED and Optical Device Packaging and Materials.- Digital Health and Bio-Medical Packaging.