Materials for Advanced Packaging (Hardcover, 2, 2017)

3D Integration Technologies - An Overview.- Advanced Bonding/Joining Techniques.- Advanced Chip-to-Substrate Connections.- Advanced Wire Bonding Technology: Materials, Methods, and Testing.- Lead-Free Soldering.- Thin Die Fabrication and Applications to Wafer Level System Integration.- Advanced Substrates: A Materials and Processing Perspective.- Flip-Chip Underfill: Materials, Process and Reliability.- New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips.- Electrically Conductive Adhesives (ECAs).- Die Attach Adhesives and Films.- Thermal Interface Materials.- Embedded Passives.- Advanced Bonding Technology Based on Nano- and Micro-metal Pastes.- Wafer Level Chip Scale Packaging.- MEMS Packaging.- LED Die Bonding.- Medical Electronics Design, Manufacturing, and Reliability.- Flexible and Printed Electronics.- Silicon Solar Cell Metallization Pastes.- Nano-metal Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices.- Characterization of Copper Diffusion in Through Silicon Vias.