Handbook of Lapping And Polishing (Hardcover)

INTRODUCTION; Ioan MarinescuFrom Craft to ScienceImportance of the AbrasiveProblem SolvingReferencesFUNDAMENTALS OF LAPPING; Eckart UhlmannGeneral ConsiderationsHistorical Development of LappingDefinition of Lapping and Classification of Lapping ProcessesProcess Mechanisms and Subsurface Damage in LappingLapping Process as a Removal SystemTool SpecificationMachine SettingsFundamentals of Planetary KinematicsProcess Models and SimulationSymbols and AbbreviationsReferencesLAPPING OF DUCTILE MATERIALS; Ioan Marinescu, Ion Benea, and Naga Jyothi SankuIntroductionPhysics of the ProcessMechanism of the ProcessReferencesBibliographyLAPPING OF BRITTLE MATERIALS; Ioan Marinescu, Ion Benea, and Mariana PruteanuIntroductionBackground InformationNontraditional Lapping ProcessesELID-Lap GrindingMaterials, Experimental Setup, and Testing Procedure (Study Case)Experimental Results and DiscussionReferencesBibliographyAppendix AAppendix BLAPPING AND LAPPING MACHINES; Toshiro K. Doi and Daizo Ichikawa IntroductionProcessing Principles of Lapping and Its CharacteristicsLapping MachineBoth-Sides Simultaneous Lapping Machine Equipped with a New Micromotion MechanismConclusionsPOLISHING TECHNOLOGY; Toshiro K. DoiPolishing PrinciplesProcessing Accuracy and Damaged LayerPolishing MachinesMechanochemical Polishing and Chemical Mechanical PolishingNoncontact PolishingMagnetoabrasive FinishingPolishing Process Applying Electrophoretic DepositionElectroabrasive Mirror Polishing ProcessP-MAC PolishingColloidal Silica PolishingReferencesCHEMICAL MECHANICAL POLISHING AND ITS APPLICATIONS IN ULSI PROCESS; Toshiro K. DoiOrientations and Role of CMP in Semiconductor ProcessBasic Concept of Planarization CMPBasic Technology of Planarization CMPThe Study Case of Device WaferThin Film Magnetic Recording HeadsCMP of Compound Semiconductor WafersReferencesINDEX