Interconnect Reliability in Advanced Memory Device Packaging (Paperback, 2023)

Chapter 1: Advanced Memory and Device Packaging.- Chapter 2: Wearout Reliability-based Characterization in Memory Packaging.- Chapter 3: Recycling of Noble Metals Used in Memory Packaging.- Chapter 4: Advanced Flip Chip Packaging.- Chapter 5: Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD).- Chapter 6: Specific Packaging Reliability Testing.- Chapter 7: Reliability Simulation and Modeling in Memory Packaging.- Chapter 8: Interconnects Reliability for Future Cryogenic Memory Applications.