Handbook of 3D Integration (Hardcover)

INTRODUCTION TO 3D INTEGRATIONDRIVER FOR 3D INTEGRATION Overview of 3D Processing Technology Fabrication of Through Silicon Vias (TSV) Fabrication, Processing and Singulation of Thin Wafers Wafer and Die Bonding Technology 3D INTEGRATION PROCESSES Universities and InstitutesStart Up Companies 3D Commerical Roadmaps DESIGN FOR 3D INTEGRATION NC State Fraunhofer U Minn ELECTRICAL PERFORMANCE AND TEST OF 3D CIRCUITS Electrical Performance - Infineon Test of 3D Circuits - Intel THERMAL MANAGEMANT Fraunhofer IZM IBM Zurich APPLICATION OF 3D INTEGRATION 3D Integratio for Next Generation Microprocessors 3D Memories Sensor Arrays TSV for Power Devices CONCLUSIONS