Handbook of 3D Integration, Volume 4: Design, Test, and Thermal Management (Hardcover)

PART I: DESIGN
3D Design Styles
Design Enablement and Advantages of Ultra-Fine Pitched 3D-Stacked Integrated Circuits
Wyoming Case Study
IBM Interposers
Interposer Interconnect Circuits
Signal Integrity for 3D
Power Integrity for 3D
2.5D/3D Design Flow
Monolithic 3D
EDA for 3D
3D Memories
3D Clock Distribution
PART II: TEST
Cost Modelling for 2.5D and 3D Stacked ICs
Interconnect Testing for 2.5D and 3D Stacked ICs
Pre-Bond Testing Through Direct Probing of Large-Array Fine-Pitch Micro-Bumps
3D Design-for-Test Architecture
Optimization of Test-Access Architectures and Test Scheduling for 3D ICs
IEEE P1838 3D Test Access Standard-in-Development
Test and Debug Strategy for TSMC CoWoS Stacking Process Based Heterogeneous 3D IC: A Silicon Case Study
PART III: THERMAL MANAGEMENT
Thermal Challenges and Emerging Solutions for 3D and 2.5D IC
Thermal Modeling and Experimental Model Validation for 3D Stacked ICs
Thermal Design for 3D ICs with Micro-Fluidics