반도체 제조기술의 이해

01 반도체 개요

● 반도체 제조기술 개요···················································5



01. 반도체 정의····································································· 7

● 반도체란?···································································7

● 반도체의 종류 ····························································8



02. 반도체 역사···································································· 9

● 트랜지스터 ·································································9

● 메모리 ···································································· 12

● 세계 메모리 반도체 선도하는 대한민국·························· 15



03. 미래 메모리 반도체························································ 17

● 메모리 시장······························································ 17

● 기술적인 한계··························································· 18

● PCRAM 제품·····························································20

● ReRAM 제품 ····························································25

● STT-MRAM 제품·······················································27

● 요약········································································31





02 DRAM Memory 제품

01. DRAM Memory 소개·····················································37

● DRAM이란? ·····························································37

● DRAM 운용 제품별 특징·············································39



02. DRAM 기본 동작 소개···················································· 41

● MOSFET·································································· 41

● DRAM Architecture ··················································45

● 주요 동작 소개··························································48

● SWD, S/A 동작 이해···················································52

● REFRESH ·······························································55



03. DRAM 주요 Process Module·········································57

● ISO / GATE·······························································57

● SAC·········································································59

● SN·········································································· 61

● MLM·······································································62



04. DRAM 변화 방향···························································64

● DRAM Memory 기술 변화 요구···································64





03 NAND Memory 제품

01. NAND FLASH Memory 소개··········································73

● FLASH Memory란?···················································73

● FLASH Memory Market Trend···································· 76



02. NAND FLASH 기본 동작 소개·········································79

● NAND Architecture···················································79

● Erase/Read/Write Operation······································83

● Cell의 형태 및 String 구조···········································93

● ISPP········································································97

● Cell 분포 및 Multi bit cell ···········································99



03. 3D NAND 구조 소개···················································· 103

● 2D NAND와 3D NAND············································103

● PUC 구조·······························································106

● CTF·······································································107

● Pipe와 Pipeless ······················································ 110

● 3D NAND Process Sequence····································111



04. 3D NAND Key Process··············································· 115

● PLUG···································································· 115

● ONOP··································································· 119

● SLIM····································································· 121



05. Future NAND FLASH Memory···································· 123

● 3D Re-NAND·························································123

● 3D Fe-NAND·························································124

● SGVC····································································124





04 Diffusion_Furnace 공정

01. Diffusion 소개···························································· 131

● Diffusion 정의·························································132

● Diffusion 대표 공정 및 소재 소개································133

● Diffusion 대표 장비 소개···········································137



02. Furnace공정 이해·······················································142

● Diffusion공정 소개··················································142

● Oxidation공정 소개·················································142

● LPCVD·································································· 149

● ALD공정································································160



03. Furnace 장비의 이해 ··················································· 170

● Furnace 장비 소개··················································· 170

● Batch 장비····························································· 171

● Chamber 장비 소개················································· 179



04. 공정과 장비 관리 소개··················································186

● 전산 시스템 활용 관리··············································186

● PM········································································186



05. 미래 기술 해결 과제······················································188





05 Diffusion (Ion Implant)

01. Ion Implantation공정 개요··········································· 195

● Ion Implantation공정의 역사와 정의··························· 195

● Ion Implantation 관련 주요 공정································197

● Ion Implantation공정의 주요 장비······························198

● Ion Implantation 장비의 주요 구성·····························200



02. DRAM/NAND Ion Implantation Application·················200

● Well Formation·······················································201

● Threshold Adjust Implant·········································202

● Source/Drain Implant··············································202

● Lightly Doped Drain················································203



03. Ion Implantation 구성과 Hardware······························205

● Gas 구성································································205

● HW 기본 구성·························································208



04. Ion Implantation Physics············································ 217

● Scattering 현상······················································· 218

● Stopping Mechanism··············································· 218

● Ion Projection Range···············································221

● Channeling Effect···················································222

● Shadowing Effect···················································224

● Damage Engineering···············································225

● Annealing······························································227

● RTA 도입 및 특징·····················································228

● 이온주입 후의 Monitoring 방법··································230



05. Ion Implantation 관련 미래 기술···································232

● Cold & Hot Implantation··········································232

● Plasma Doping·······················································233

● Co Implantation······················································235

● Advanced Anneal···················································237





06 Thinfilm_ CVD 공정

01. CVD공정 소개 ····························································245

● CVD공정 정의·························································246



02. CVD공정의 역할 및 이해···············································248

● 절연막 역할····························································248

● Gap fill 특성····························································251

● HARD MASK 역할···················································252

● Low-k 절연막·························································253



03. CVD 제조 Fab 장비의 이해············································254

● 장비 관리 특성························································255

● 주요 부품 특성의 이해··············································257



04. CVD 주요 공정 장비의 소개···········································263

● PE CVD USG공정····················································263

● Thermal CVD BPSG공정··········································264

● PE CVD ARC공정····················································266

● HDP공정································································268

● SOD공정································································271

● PE Nitride공정························································273

● ACL Hard Mask공정·················································273

● Low-k공정·····························································275

● NDC공정································································276

● Gate ON Stack공정·················································277



05. CVD 장비 향후 Trends·················································278





07 Thinfilm_ PVD 공정

01. PVD공정····································································285

● PVD공정 소개·························································285



02. PVD공정의 요구사항····················································286



03. Metal 물질의 특성·······················································286

● Aluminum 물질·······················································287

● Titanium 물질·························································287

● Tungsten 물질························································288

● Cobalt 물질····························································289

● Tantalum 물질························································289

● Copper 물질···························································290



04. PVD 주요 특성의 이해··················································290

● Sheet Resistance····················································290

● Contact Silicide 특성················································291

● EM 현상·································································292

● ALD 방식·······························································293

● Damascene 구조·····················································293



05. PVD공정의 Fab 장비의 이해·········································294

● Sputter공정 장비·····················································296

● Contact Silicide·······················································300

● ALD TiN 장비·························································302

● CVD W 장비···························································304

● LFW 장비·······························································307

● EP Cu 장비·····························································309

● Cu Barrier Metal 장비·············································· 312



06. PVD공정 향후 Trends·················································· 314





08 Photo 공정

01. Photo공정의 역할························································321

● Photo공정 소개·······················································321

● Photo Process의 이해··············································322

● Photo 장비의 종류···················································324

● Photo에 사용되는 소재·············································328



02. Photo공정·································································330

● Imaging·································································330

● Focus····································································336

● Dose·····································································338

● Leveling·································································339

● Overlay··································································339

● Alignment······························································ 341

● Overlay··································································345

● Overlay Control······················································348

● MASK····································································353

● Photo Resist···························································357



03. Photo 장비·································································363

● Track·····································································363

● Scanner·································································370



04. Photo공정 관리··························································377

● Overlay··································································377

● Incell·····································································379

● CD········································································379

● Defect···································································381



05. Photo 미래 기술··························································382

● 차세대 Photo Graphy 기술········································382

● EUV란···································································386

● 기존 ArF와의 차이점················································387

● EUV 기술의 문제점··················································388





09 Etch 공정

01. Etch 소개···································································397

● 실생활에서 본 Etch Engineering 개요 ························397



02. Etch 기본···································································402

● FAB공정과 반도체 소자············································402

● Etch의 원리와 메커니즘············································408

● 플라즈마 정의와 성질··············································· 413

● Etch 고려사항························································· 419

● Etch공정관리를 위한 결과물······································431

● 식각 가스와 식각 물질 ·············································440



03. Etch 적용과 응용·························································444

● Etch 대표 구조공정··················································444

● Etch 장비 구성과 종류··············································454

● Plasma Source에 따른 Etch 장비 구분························465



04. ETCH 실전, 양산 FAB에서 ETCH 엔지니어 업무··············· 476

● 팹에서의 양산 기술·················································· 476

● Etch 장비의 유지 관리··············································482

● 양산에서 Etch가 가지는 어려움··································487

● Etch 양산 엔지니어의 하루········································489



05. Etch Issue 및 향후 개발 방향········································490

● 반도체 미세화 트렌트와 식각 이슈······························490

● 기술적 한계 극복 방안과 기술 발전 방향······················492





10 Cleaning 공정

01. Cleaning공정······························································507

● Cleaning공정 소개···················································507



02. Cleaning Chemical의 종류와 특징 ································ 511

● SPM 세정······························································· 511

● APM 세정······························································· 514

● DHF / BOE 세정······················································ 517

● H3PO4, Phosphoric Acid 세정····································520

● Ozone 세정 ···························································521

● NFAM 세정····························································525

● Function Water 세정················································527

● HF/NH3 Gas 건식 세정·············································531



03. Cleaning 장비의 종류와 특징 ········································534

● Batch Type····························································534

● Wet Single Type·····················································537

● Dry Single Type······················································539

● Scrubber 세정························································542



04. Cleaning공정의 품질 관리와 생산장비 관리····················544

● defect ··································································544

● Uniformity ····························································546

● Contamination ·······················································548

● Fume····································································548

● Cross contamination···············································550

● Selectivity······························································552

● Leaning·································································553

● Flow Rate······························································555

● Temperature··························································557

● Concentration ·······················································559

● Exhaust ······························································· 561

● Pressure ·······························································563



05. Cleaning의 미래기술 ····················································565





11 CMP 공정

01. CMP공정 소개·····························································573



02. CMP공정의 종류와 특징···············································578

● Planarization··························································578

● Isolation·································································580

03. CMP 장비의 구성과 특징··············································582



● Polisher·································································582

● Cleaner··································································584

● EPD······································································587



04. CMP공정의 품질 관리와 생산 장비 관리··························591

● Defect, Scratch·······················································591

● Uniformity, APC······················································594

● Slurry ···································································596

● Selectivity······························································599

● Dishing, Erosion······················································600

● Pad ······································································602

● Disk ······································································604

● Membrane·····························································605

● Retainer Ring ·························································609

● Brush ··································································· 610

● Filter ·····································································611



05. CMP의 미래 기술 ························································ 613





12 MI (Metrology & Inspection)

01. Metrology ·································································621

● Metrology 개론·······················································621

● Device 박막 두께 측정··············································621

● Device 구조/형태 측정·············································626

● 박막 조성/물성 측정·················································631

● 휨 측정··································································638



02. Inspection·································································639

● Inspection 개론·······················································639

● BF/DF 검사·····························································640

● 파티클 카운터·························································643

● 매크로 검사····························································645

● 전자빔 검사····························································645



03. 공정 계측 응용기술······················································648

● 가상계측································································648

● 측정 검사 기술 동향과 미래······································649





13 반도체 용어해설

반도체 용어해설·································································656