Electronic Assembly Fabrication

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· 제목 : Electronic Assembly Fabrication (Hardcover) (Chips, Circuit Boards, Packages, and Components)
· 분류 : 외국도서 > 기술공학 > 기술공학 > 전기공학
· ISBN : 9780071378826
· 쪽수 : 672쪽
· 출판일 : 2002-04-10

Chapter 1: Printed Circuit History and Overview

Chapter 2: Development and Fabrication of IC Chips

Chapter 3: Packaging of IC Chips

Chapter 4: Laminates and Prepregs as Circuit Board Base Materials

Chapter 5: Printed Circuit Board Fabrication

Chapter 6: Package and Component Attachment and Interconnection

Chapter 7: Solder Materials and Processes for Electronic Assembly Fabrication

Chapter 8: Printed Wiring Board Cleaning

Chapter 9: Board Coating Materials and Processes

Chapter 10: Flexible and Rigid Flexible Fabrication

Chapter 11: Fabrication and Properties of Electronic Ceramics and Composites

Chapter 12: Hybrid Microelectronics and Multichip Module Technologies

Chapter 13: Environmental Considerations in Electronic Assembly Fabrication

Index

About the Editor

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Electronic Assembly Fabrication (Hardcover)

(Chips, Circuit Boards, Packages, and Components)

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