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· 제목 : Electronic Packaging and Interconnection Handbook 4/E (Hardcover, 4) 
· 분류 : 외국도서 > 기술공학 > 기술공학 > 전기공학
· ISBN : 9780071430487
· 쪽수 : 1000쪽
· 분류 : 외국도서 > 기술공학 > 기술공학 > 전기공학
· ISBN : 9780071430487
· 쪽수 : 1000쪽
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CONTRIBUTORS
PREFACE
Chapter 1: Plastics, Elastomers, and Composites
Chapter 2: Adhesives, Underfills, and Coatings
Chapter 3: Thermal Management
Chapter 4: Connector and Interconnection Technology
Chapter 5: Solder Technologies for Electronic Packaging and Assembly
Chapter 6: Packaging and Interconnection of Integrated Circuits
Chapter 7: Hybrid Microelectronics and Multichip Modules
Chapter 8: Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies
Chapter 9: Rigid and Flexible Printed Circuit Board Technology
Chapter 10: Packaging of High-Speed and Microwave Electronic Systems
INDEX
Chapter 1: Plastics, Elastomers, and Composites
Chapter 2: Adhesives, Underfills, and Coatings
Chapter 3: Thermal Management
Chapter 4: Connector and Interconnection Technology
Chapter 5: Solder Technologies for Electronic Packaging and Assembly
Chapter 6: Packaging and Interconnection of Integrated Circuits
Chapter 7: Hybrid Microelectronics and Multichip Modules
Chapter 8: Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies
Chapter 9: Rigid and Flexible Printed Circuit Board Technology
Chapter 10: Packaging of High-Speed and Microwave Electronic Systems
INDEX
Chapter 3: Thermal Management
Chapter 4: Connector and Interconnection Technology
Chapter 5: Solder Technologies for Electronic Packaging and Assembly
Chapter 6: Packaging and Interconnection of Integrated Circuits
Chapter 7: Hybrid Microelectronics and Multichip Modules
Chapter 8: Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies
Chapter 9: Rigid and Flexible Printed Circuit Board Technology
Chapter 10: Packaging of High-Speed and Microwave Electronic Systems
INDEX
Chapter 5: Solder Technologies for Electronic Packaging and Assembly
Chapter 6: Packaging and Interconnection of Integrated Circuits
Chapter 7: Hybrid Microelectronics and Multichip Modules
Chapter 8: Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies
Chapter 9: Rigid and Flexible Printed Circuit Board Technology
Chapter 10: Packaging of High-Speed and Microwave Electronic Systems
INDEX
Chapter 7: Hybrid Microelectronics and Multichip Modules
Chapter 8: Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies
Chapter 9: Rigid and Flexible Printed Circuit Board Technology
Chapter 10: Packaging of High-Speed and Microwave Electronic Systems
INDEX
Chapter 9: Rigid and Flexible Printed Circuit Board Technology
Chapter 10: Packaging of High-Speed and Microwave Electronic Systems
INDEX
INDEX
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