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· 제목 : [eBook Code] Copper -- Fundamental Mechanisms for Microelectronic Applications (eBook Code, 1st)
· 분류 : 외국도서 > 기술공학 > 기술공학 > 재료과학
· ISBN : 9780470347874
· 쪽수 : 337쪽
· 출판일 : 2008-05-02
· 분류 : 외국도서 > 기술공학 > 기술공학 > 재료과학
· ISBN : 9780470347874
· 쪽수 : 337쪽
· 출판일 : 2008-05-02
목차
Overview of IC Interconnects.
Behavior of Copper Impurity Atoms.
Copper-Related Defects in Silicon.
Chemistry and Electrochemistry.
Copper in Inorganic Dielectrics.
Copper in Organic Dielectrics (Polymers).
Diffusion and Compound Formation.
Layered Structures Containing Copper.
Copper for IC Metallization.
Future Directions in Copper Technology.
Appendix.
Index.
