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· 제목 : Chemical Mechanical Planarization of Microelectronic Materials (Hardcover)
· 분류 : 외국도서 > 기술공학 > 기술공학 > 전자공학 > 반도체
· ISBN : 9780471138273
· 쪽수 : 337쪽
· 출판일 : 1997-01-31
· 분류 : 외국도서 > 기술공학 > 기술공학 > 전자공학 > 반도체
· ISBN : 9780471138273
· 쪽수 : 337쪽
· 출판일 : 1997-01-31
목차
Chemical Mechanical Planarization-An Introduction.
Historical Motivations for CMP.
CMP Variables and Manipulations.
Mechanical and Electrochemical Concepts for CMP.
Oxide CMP Process-Mechanisms and Models.
Tungsten and CMP Processes.
Copper CMP.
CMP of Other Materials and New CMP Applications.
Post-CMP Cleanup.
Appendix.
Index.
![[eBook Code] Copper -- Fundamental Mechanisms for Microelectronic Applications (eBook Code, 1st)](/img_thumb2/9780470347874.jpg)
