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· 제목 : Electronic Packaging Materials and Their Properties (Hardcover) 
· 분류 : 외국도서 > 기술공학 > 기술공학 > 전기공학
· ISBN : 9780849396250
· 쪽수 : 128쪽
· 출판일 : 1998-12-18
· 분류 : 외국도서 > 기술공학 > 기술공학 > 전기공학
· ISBN : 9780849396250
· 쪽수 : 128쪽
· 출판일 : 1998-12-18
목차
IntroductionProperties of Electronics Packaging MaterialsElectrical PropertiesThermal and Thermomechanical PropertiesMechanical PropertiesChemical PropertiesMiscellaneous PropertiesZeroth-Level Packaging MaterialsSemiconductorsAttachment MaterialsSubstratesFirst-Level Packaging MaterialsWire InterconnectsTape InterconnectsCase MaterialsLid SealsLeadsSecond-Level Packaging MaterialsReinforcement Fiber MaterialsResinsLaminatesConstraining CoresFlexible Wiring Board MaterialsConductor Metals in LaminatesConformal CoatingsThird-Level Packaging MaterialsBackpanel MaterialsConnectors MaterialsCables and Flex Circuit MaterialsSummaryAppendicesIndex
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