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· 분류 : 외국도서 > 기술공학 > 기술공학 > 전기공학
· ISBN : 9781119679769
· 쪽수 : 384쪽
· 출판일 : 2020-12-30
목차
About the Editor
List of Contributors
preface
1. CONNECTORS
1.1. Challenges of Separable Connectors
1.2. Components of a Connector
1.2.1. Contact Springs
1.2.2. Contact Finishes
1.2.2.1. Noble Metal Contact Finishes
1.2.2.2. Non-noble Metal Contact Finishes
1.2.3. Connector Housing
1.2.4. Contact Interface
1.3. Connector Types
1.3.1. Board-to-Board Connectors
1.3.2. Wire/Cable-to-Wire/Cable Connectors
1.3.3. Wire/Cable-to-Board Connectors
1.4. Connector Terminology
2. CONNECTOR HOUSING
2.1. Mechanical Properties
2.2. Electrical Properties
2.3. Flammability
2.4. Temperature Rating
2.5. Housing Materials
2.5.1. Thermoplastic Polymers
2.5.1.1. Polyesters
2.5.1.2. Polyimides, Polyamide-imides, and Polyetherimides
2.5.1.3. Polyphenylene Sulfides
2.5.1.4. Polyether Ether Ketones
2.5.1.5. Liquid-crystalline Polymers
2.5.1.6. Comparison of Thermoplastic Polymers
2.5.2. Thermosetting Polymers
2.5.3. Additives to Housing Materials
2.5.4. Manufacturing of Housing Materials
3. CONTACT SPRING
3.1. Copper Alloys
3.1.1. Unified Number System (UNS)
3.1.2. Properties of Copper Alloys
3.2. Nickel Alloys
3.3. Conductive Elastomers
3.4. Contact Manufacturing
4. CONTACT PLATING
4.1. Noble Metal Plating
4.1.1. Gold
4.1.2. Palladium
4.1.3. Combination of Gold and Palladium
4.2. Non-noble Metal Plating
4.2.1. Silver
4.2.1.1. Characteristics of Silver as a Contact Finish
4.2.1.2. Potential Tarnish-Accelerating Factors
4.2.1.3. Use of Silver in Typical Connectors
4.2.1.4. Managing Silver Corrosion
4.2.2. Silver-Palladium Alloys
4.2.3. Nanocrystalline Silver Alloys
4.2.4. Silver-Bismuth Alloys
4.2.5. Tin
4.2.6. Nickel Contact Finishes
4.3. Underplating
4.4. Plating Process
4.4.1. Electrolytic Plating
4.4.2. Electroless Plating
4.4.3. Cladding
4.4.4. Hot Dipping
5. CONNECTOR INSERTION AND EXTRACTION
5.1. Insertion and Extraction Forces
5.2. Contact Retention
5.3. Contact Force and Deflection
5.4. Contact Wipe
6. CONTACT INTERFACE
6.1. Constriction Resistance
6.2. Contact Resistance
6.3. Other Factors Affecting Contact Resistance
6.4. Current Rating
6.5. Capacitance and Inductance
6.6. Bandpass and Bandwidth
7. THE BACK-END CONNECTION
7.1. Connection Through Soldering
7.2. Press-fit Connection
7.3. Crimping Connection
7.4. Insulation Displacement Connection
8. LOADS AND FAILURE MECHANISMS
8.1. Environmental Loads
8.1.1. Temperature
8.1.2. Vibration Load
8.1.3. Humidity
8.1.4. Contamination
8.1.5. Differential Pressure
8.2. Failure Mechanisms in Electrical Connectors
8.2.1. Silver Migration
8.2.2. Tin Whiskers
8.2.3. Corrosion Failure
8.2.4. Arc Formation
8.2.5. Creep Failure
8.2.6. Wear
8.2.7. Frictional Polymerization
8.3. Case Study by NASA: Electrical Connectors for Spacecraft
9. FRETTING IN CONNECTORS
9.1. Mechanisms of Fretting Failure
9.1.1. Material Factors That Affect Fretting
9.1.1.1. Contact Materials
9.1.1.2. Hardness
9.1.1.3. Surface Finish
9.1.1.4. Frictional Polymerization
9.1.1.5. Grain Size
9.1.1.6. Oxides
9.1.1.7. Coefficient of Friction
9.1.1.8. Electrochemical Factor
9.1.2. Operating Factors That Affect Fretting
9.1.2.1. Contact Load
9.1.2.2. Fretting Frequency
9.1.2.3. Slip Amplitude
9.1.2.4. Electric Current
9.1.3. Environmental Factors That Affect Fretting
9.1.3.1. Humidity
9.1.3.2. Temperature
9.1.3.3. Dust
9.2. Reducing the Damage of Fretting
9.2.1. Lubrication
9.2.2. Improvement in Design
9.2.3. Coatings
10. TESTING
10.1. Dielectric Withstanding Voltage Testing
10.2. Insulation Resistance Testing
10.3. Contact Resistance Testing
10.4. Current Rating
10.5. Electromagnetic Interference and Electromagnetic Compatibility Testing
10.6. Temperature Life Testing
10.7. Thermal Cycling Testing
10.8. Thermal Shock Testing
10.9. Steady-State Humidity Testing
10.10. Temperature Cycling with Humidity Testing
10.11. Corrosion
10.11.1. Dry Corrosion
10.11.2. Creep Corrosion
10.11.3. Moist Corrosion
10.11.4. Fretting Corrosion
10.12. Mixed Flowing Gas Testing
10.12.1. Battelle Labs MFG Test Methods
10.12.2. EIA MFG Test Methods: EIA 364-TP65A
10.12.3. IEC MFG Test Methods: IEC 68-2-60 Part 2
10.12.4. Telcordia MFG Test Methods: Telcordia GR-63-CORE Section 5.5
10.12.5. IBM MFG Test Methods: G1(T)
10.12.6. CALCE MFG Chamber Capability
10.13. Vibration
10.13.1. Mechanical Shock
10.13.2. Mating Durability
10.14. Highly Accelerated Life Testing
10.15. Environmental Stress Screening
11. SUPPLIER SELECTION: RELIABILITY CAPABILITY ASSESSMENT
11.1. Connector Reliability
11.2. Capability Maturity Models
11.3. Key Reliability Practices
11.3.1. Reliability Requirements and Planning
11.3.2. Training and Development
11.3.3. Reliability Analysis
11.3.4. Reliability Testing
11.3.5. Supply-Chain Management
11.3.6. Failure Data Tracking and Analysis
11.3.7. Verification and Validation
11.3.8. Reliability Improvement
11.4. Reliability Capability of an Organization
11.5. The Evaluation Process
12. SELECTING THE RIGHT CONNECTOR
12.1. Connector Requirements Based on Design and Targeted Application
12.2. Mating Cycles
12.3. Current and Power Ratings
12.4. Environmental Conditions
12.5. Termination Types
12.6. Materials
12.6.1. Connector Housing Materials
12.6.2. Connector Spring Materials
12.7. Contact Finishes
12.8. Reliability
12.9. Raw Cables and Assemblies
12.10. Supplier Reliability Capability Maturity
12.11. Connector Selection Team
12.12. Selection of Candidate Parts from a Preferred Parts Database
12.13. Electronic Product Manufacturers’ Parts Databases
12.14. Parts Procurement
12.15. Parts Availability
12.16. High-Speed Connector Selection
12.17. NASA Connector Selection
12.18. Harsh Environment Connector Selection
12.19. Fiber Optic Interconnect Requirements by Market
12.20. High-Power Subsea Connector Selection
12.20.1. Undersea Connector Reliability
12.21. Screening Tests
12.22. Low-Voltage Automotive Single- and Multiple-Pole Connector Validation
12.23. Failure Modes, Mechanisms, and Effects Analysis for Connectors
12.24. Connector Experiments
12.25. Summary
13. SIGNAL CONNECTOR SELECTION
13.1. Issues Involving High-Speed Connectors
13.2. Signal Transmission Quality Considerations
13.2.1. Interconnect Delays
13.2.2. Signal Distortion
13.3. Electromagnetic Compatibility
13.4. Virtual Prototyping
13.4.1. TDR Impedance Measurements
13.4.1.1. Reflection Coefficient
13.4.1.2. TDR Resolution Factors
13.4.1.3. TDR Accuracy Factors
13.5. Vector Network Analyzer
13.6. Simulation Program with Integrated Circuit Emphasis (SPICE)
14. ADVANCED TECHNOLOGY ATTACHMENT CONNECTORS
14.1. ATA Connector and SATA Connector Overview
14.2. History of ATA and SATA
14.3. Physical Description of ATA Connectors, ATA Alternative Connectors, and SATA Connectors
14.4. ATA Standardization and Revisions
14.5. SATA Standardization and Revisions
14.6. SATA in the Future
15. POWER CONNECTORS
15.1. Requirements for Power Connectors
15.2. Power Connector Materials
15.3. Types of Power Connectors
15.4. Power Contact Resistance
15.5. Continuous, Transient, and Overload Current Capacities
15.5.1. Continuous Current Capacity
15.5.2. Transient Current Capacity
15.5.3. Overload Current Capacity
15.6. Current Rating Method
16. ELECTRICAL CONNECTORS FOR UNDERWATER APPLICATIONS
16.1. Background and Terminology
16.1.1. History
16.1.2. Terminology
16.2. Commercial Off-the-Shelf (COTS) Connectors
16.2.1. Rubber-molded
16.2.2. Rigid-shell or Bulkhead Assemblies
16.2.3. Fluid-filled Underwater Mateable
16.2.4. Inductive Coupling
16.2.5. Assemblies (Non-mateable)
16.3. Connector Design
16.3.1. Thermal Design
16.3.2. Electrical Properties
16.3.3. Mechanical Properties
16.3.4. Material Choices
16.3.5. Specifications for Underwater Connectors
16.4. Connector Deployment and Operation
16.4.1. Connection Procedure
16.4.2. Connection Layout
16.4.3. Reliability
16.5. Discussion and Conclusion
17. EXAMPLES OF CONNECTORS
17.1. Amphenol ICC M-Series™ 56 Connectors
17.2. Amphenol ICC Paladin® Connectors
17.3. Amphenol ICC 3000W EnergyEdge™ X-treme Card Edge Series
17.4. Amphenol ICC FLTStack Connectors
17.5. Amphenol ICC HSBridge Connector System
17.6. Amphenol ICC MUSBR Series USB 3.0 Type-A Connectors
17.7. Amphenol ICC Waterproof USB Type-C™ Connectors
17.8. Amphenol ICC NetBridge™ Connectors
17.9. Amphenol Sine DuraMate™ AHDP Circular Connectors
17.10. Amphenol Aerospace MIL-DTL-38999 Series III Connectors
17.11. Fischer Connectors UltiMate™ Series Connectors
17.12. Hirose Electric DF50 Series Connectors
17.13. Hirose Electric microSD™ Card Connectors
17.14. Molex SAS-3 and U.2 (SFF-8639) Backplane Connectors
17.15. Molex NeoPress™ Mezzanine Connectors
17.16. Molex Impel™ Plus Backplane Connectors
17.17. Molex EXTreme Guardian™ Power Connectors
17.18. Molex Imperium™ High Voltage/High Current Connectors
17.19. TE Connectivity Free Height Connectors
17.20. TE Connectivity STRADA Whisper Connectors
17.21. TE Connectivity MULTI-BEAM High-Density (HD) Connectors
17.22. TE Connectivity HDMI™ Connectors
17.23. TE Connectivity AMP CT Connector Series
17.24. TE Connectivity Micro Motor Connectors
17.25. TE Connectivity AMPSEAL Connectors
17.26. TE Connectivity M12 X-code Connectors
17.27. TE Connectivity SOLARLOK 2.0 Connectors
17.28. TE Connectivity Busbar Connectors
APPENDIX: STANDARDS
A.1. Standard References for Quality Management and Assurance
A.2. General Specifications for Connectors
A.3. Safety-Related Standards and Specifications
A.4. Standard References for Connector Manufacturing
A.5. Standard References for Socket Material Property Characterization
A.6. Standard References for Socket Performance Qualification
A.7. Standard References for Socket Reliability Qualification
A.8. Other Standards and Specifications
A.9. Telcordia
A.10. Society of Cable Telecommunications Engineers (SCTE)
A.11. Electronic Industries Alliance/Telecommunications Industry Association (EIA/TIA)
A.12. International Electrotechnical Commission (IEC)
A.12.1 IEC Standards
A.12.2 IEC Connectors
A13. Military Standards (MIL-STD)
A.14. Standards for Space-Grade Connectors
