Electronics Manufacturing: With Lead-Free, Halogen-Free, and Conductive-Adhesive Materials (Hardcover)

Chapter 1: Introduction to Environmentally Benign Electronics Manufacturing

Chapter 2: Chip (Wafer)-Level Interconnects with Lead-Free Solder Bumps

Chapter 3: WLCSP with Lead-Free Solder Bumps on PCB/Substrate

Chapter 4: Chip (Wafer)-Level Interconnects with Solderless Bumps

Chapter 5: WLCSP with Solderless Bumps on PCB/Substrate

Chapter 6: Environmentally Benign Molding Compounds for IC Packages

Chapter 7: Environmentally Benign Die Attach Films for IC Packaging

Chapter 8: Environmental Issues for Conventional PCBs

Chapter 9: Halogenated and Halogen-Free Materials for Flame Retardation

Chapter 10: Fabrication of Environmentally Friendly PCB

Chapter 11: Global Status of Lead-Free Soldering

Chapter 12: Development of Lead-Free Solder Alloys

Chapter 13: Prevailing Lead-Free Alloys

Chapter 14: Lead-Free Surface Finishes

Chapter 15: Implementation of Lead-Free Soldering

Chapter 16: Challenges for Lead-Free Soldering

Chapter 17: Introduction to Conductive Adhesives

Chapter 18: Conductivity Establishment of Conductive Adhesives

Chapter 19: Mechanisms Underlying the Unstable Contact Resistance of ECAs

Chapter 20: Stabilization of Contact Resistance of Conductive Adhesives

Index

About the Author