Microelectronic Packaging (Hardcover)

INTRODUCTION Electrochemical Processing Technologies and their Impact in Microelectronic Packaging, Madhav Datta CHIP METALLIZATIONElectroplating Process for Cu Chip Metallization, Valery M. Dubin, Harsono S. Simka, Sadasivan Shankar, Peter Moon, Thomas Marieb, and Madhav DattaElectroless Barrier and Seed Layers for On-Chip Metallization, Valery M. Dubin, Sergey Lopatin, Amit Kohn, Nick Petrov, Moshe Eizenberg, and Yosi Shacham-DiamandAlternative Materials for ULSI and MEMS Metallization, Yosi Shacham-Diamand, Nathan Croitoru, Alexander Inberg, Yelena Sverdlov, Valery Dubin, and Vadim BogushCHIP-PACKAGE INTERCONNECTTape Carrier and Development Trend, Osamu Yoshika, and Akira ChindaFlip-chip Interconnection, Madhav DattaCompliant Interconnects, Paul KohlPb-free Flip-chip Technologies, D. R. Frear, and W.H. LytlePACKAGES AND PC BOARDSMaterials Overview in Organic Packaging, Saikumar Jayaraman, John Tang, and Vijay WakharkarGlass-Ceramic Packages, Kazuhiro Ikuina, Yuzo Shimada, and Kazuaki UtsumiElectrochemical Processes in the Fabrication of Multi-chip Modules, S. Krongelb, L.T. Romankiw, E.D. Perfecto, and K.K.H. WongBumping Technology for Advanced Packages, Shinichi WakabayashiPlated Through Hole Technology for Boards, Haruo AkahoshiPROCESSING TOOLSElectroplated Contact Materials for Connectors and Relays, Yutaka OkinakaChemical Mechanical Planarization: From Scratch to Planar, David K. Watts, Norio Kimura, and Manabu TsujimuraElectrochemical Deposition Equipment, Tom Ritzdorf, and Dakin FultonProcesses and Equipment for Wet Etching and Cleaning, Jeffery W. Butterbaugh