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"chemical mechanical"(으)로 39개의 도서가 검색 되었습니다.
9781025116495

Chemical Mechanical Polishing Optimization for 4H-Sic

 | Hutson Street Press
32,980원  | 20250522  | 9781025116495
Scratch free surfaces are required for substrates used in epitaxial growth. Silicon carbide (SiC) is a substrate material that is used in the epitaxial growth of SiC, GaN, and InGaN electronic devices. Preliminary chemical mechanical polishing (CMP) studies of 1 3/8" 4H-SiC wafers were performed in an attempt to identify the polishing parameter values that result in a maximum material removal rate and thus reduce substrate polishing time.
9781025111568

Chemical Mechanical Polishing Optimization for 4H-Sic

 | Hutson Street Press
56,870원  | 20250522  | 9781025111568
Scratch free surfaces are required for substrates used in epitaxial growth. Silicon carbide (SiC) is a substrate material that is used in the epitaxial growth of SiC, GaN, and InGaN electronic devices. Preliminary chemical mechanical polishing (CMP) studies of 1 3/8" 4H-SiC wafers were performed in an attempt to identify the polishing parameter values that result in a maximum material removal rate and thus reduce substrate polishing time.
9780367393250

Tribology In Chemical-Mechanical Planarization

Liang, Hong, Craven, David  | CRC Press
143,280원  | 20190919  | 9780367393250
The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces.
9783639001662

Process Modeling of Chemical Mechanical Planarization

 | KS OmniScriptum Publishing
139,650원  | 20080529  | 9783639001662
Chemical Mechanical Planarization (CMP) is one of the key enabling technologies for modern IC fabrication. However, mainly due to the high complexities coming from various interactions among mechanical reactions and chemical reactions, its fundamental working mechanism is still not fully understood.
9780824725679

Tribology in Chemical-Mechanical Planarization 양장본 Hardcover

Liang, Hong/ Craven, David/ CRAVEN, DAVID R.  | Marcel Dekker
467,770원  | 20050228  | 9780824725679
9780530001234

Fundamental Studies on Silicon Dioxide Chemical Mechanical Polishing

Mahajan, Uday  | Dissertation Discovery Company, LLC
168,950원  | 20181206  | 9780530001234
Dissertation Discovery Company and University of Florida are dedicated to making scholarly works more discoverable and accessible throughout the world. This dissertation, "Fundamental Studies on Silicon Dioxide Chemical Mechanical Polishing" by Uday Mahajan, was obtained from University of Florida and is being sold with permission from the author. A digital copy of this work may also be found in the university's institutional repository, IR@UF.
9780530001227

Fundamental Studies on Silicon Dioxide Chemical Mechanical Polishing

 | Dissertation Discovery Company, LLC
121,180원  | 20181206  | 9780530001227
Dissertation Discovery Company and University of Florida are dedicated to making scholarly works more discoverable and accessible throughout the world. This dissertation, "Fundamental Studies on Silicon Dioxide Chemical Mechanical Polishing" by Uday Mahajan, was obtained from University of Florida and is being sold with permission from the author. A digital copy of this work may also be found in the university's institutional repository, IR@UF.
9782881246289

Process Control Engineering (A Textbook for Chemical, Mechanical, and Electrical Engineers)

 | Routledge
102,030원  | 19931001  | 9782881246289
A textbook for chemical, mechanical and electrical engineering students, providing the theoretic fundamentals of control systems, and highlighting modern control theory and practical aspects of industrial processes. The book also includes an instructors manual and diskette.
9783843363464

Engineered Particulate Systems for Chemical Mechanical Planarization

Basim, G. Bahar  | KS OmniScriptum Publishing
139,650원  | 20110110  | 9783843363464
Chemical mechanical polishing (CMP) is used in microelectronics industry to planarize and pattern metal and dielectric layers. Decrease in the sizes of the devices and introduction of new materials necessitate improved control of the CMP that can be achieved by studying the slurry chemical and particulate properties. In this study, the impacts of slurry particle size distribution and stability on pad-particle-surface interactions are investigated.
9783639035643

Sensor-based Modeling and Monitoring of Chemical Mechanical Polishing

 | KS OmniScriptum Publishing
203,960원  | 20081201  | 9783639035643
This book provides a framework for real time control of the Chemical Mechanical Planarization (CMP) process based on combining nonlinear dynamics principles with statistical process monitoring approaches. CMP has a direct bearing on the computational speed and dimensional characteristics of solid state devices.
9783540431817

Chemical-Mechanical Planarization of Semiconductor Materials Paperback

Oliver, M. R. (EDT)  | Springer
496,100원  | 20040319  | 9783540431817
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
9780471138273

Chemical Mechanical Planarization of Microelectronic Materials Paperback

 | Wiley
0원  | 19970101  | 9780471138273
9780471719199

Microelectronic Applications of Chemical Mechanical Planarization Paperback

Li, Yuzhuo (EDT)  | Wiley
341,950원  | 20071019  | 9780471719199
This book provides systematic and comprehensive description about the current state of CMP technology. It includes the important fundamentals and basic science as well, making the book fit as an introduction to CMP newcomers and a valuable reference source for professionals.
9780127521725

Semiconductors and Semimetals : Chemical Mechanical Polishing in Silic Paperback

Li, Shin Hwa (Edt)/ Miller, Bo  | Academic
0원  | 19991015  | 9780127521725
Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded. Reflecting the truly interdisciplinary nature of the field that the series covers, the volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in modern industry.
9789811061660

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

 | Springer Nature B.V.
73,480원  | 20170913  | 9789811061660
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry.
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